Abstract: A test fixture for an electronic device is provided that removes debris from a socket of the test fixture using back side air blow off. In general, the test fixture includes a circuit board, a socket on a front side of the circuit board, and an air manifold on a back side of the circuit board. Pressurized air is provided to the air manifold through an air supply inlet coupling the air manifold to an external pressurized air supply. At least one via formed through the circuit board fluidly couples the air manifold on the back side of the circuit board to the socket on the front side of the circuit board. Accordingly, the pressurized air from the air manifold flows through the vias and up through the socket such that debris is removed from the socket.

Abstract: Testing systems are provided for testing a device under test (DUT), such as an integrated circuit. A preferred testing system includes a test array that incorporates a frame. The frame defines an aperture that is appropriately sized and shaped for receiving a DUT and mounts a testing probe that is adapted to extend into the aperture. The probe preferably is received within a recess formed along a bottom surface of the frame, thereby tending to enable the bottom surface of the frame to properly engage a surface to which it is to be mounted. Additionally, the probe may incorporate a configuration that tends to maintain the position of the probe relative to the frame and, thus, relative to the aperture. For instance, a shaped portion may be intermediately disposed along the length of the probe. So configured, when the shaped portion of the probe is received within a corresponding complimentary-shaped portion of its recess, the probe is substantially prevented from being urged along its longitudinal axis.