Abstract: A system for curing a thermoset composite may include a tooling die configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure media bag configured to be placed over the uncured thermoset composite part disposed on the tooling die and including a pressure media; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed on the tooling die, the pressure media bag may be configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed on the tooling die.

Abstract: A system for curing a thermoset composite may include a tooling die configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure media bag configured to be placed over the uncured thermoset composite part disposed on the tooling die and including a pressure media; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed on the tooling die, the pressure media bag may be configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed on the tooling die.

Abstract: Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

Abstract: Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

Abstract: A method and apparatus for measuring diameters of holes and countersinks. A tip of a countersink measurement system may be moved to engage a countersink for a hole. A diameter of the countersink may be measured in response to the tip of the countersink measurement system engaging the countersink. A probe may be moved through the tip of the countersink measurement system into a channel for the hole, while the tip is engaged with the countersink. A number of diameters for the channel may be measured as the probe moves in the hole.

Abstract: A method, system, and computer program product for providing a service offering to an IT services provider client and managing the capabilities of the IT services provider is provided. In one embodiment a market is organized into market framework components. The resources of the IT services provider are organized into capability blocks each of which is associated with a respective market framework component. When a customer problem is received or determined, the customer problem is separated into customer market framework components. Capability block types that are associated with the customer market framework components are then determined and instances of available capability blocks types associated with the customer market framework components are grouped together to form a service offering which satisfies the customer problem.