Abstract: The ultrasonic sensor assembly is provided. The assembly includes a first and second flexible sets of transducers wrapped and permanently attached to the pipe at first and second locations, respectively. Each set of transducers includes at least transducers arranged in a row. The first set of transducers is configured to transmit a wave along the pipe. The second set of transducers is configured to receive the wave transmitted along the pipe. The ultrasonic sensor assembly includes a controller operatively connected to the second set of transducers for receiving information about the wave received by the second set of transducers. The controller is configured to analyze the information about the wave received by the second set of transducers to determine the presence of possible defects in the pipe. An associated method is also provided.

Abstract: Systems and methods are disclosed herein in which multi-level square wave excitation signals are used instead of or in addition to fully-analog excitation signals to drive an array of transceiver elements to create a sound field. Use of multi-level square wave excitation signals produces acceptable transceiver output with reduced complexity, cost, and/or power consumption as compared with use of fully-analog excitation signals. In addition, use of such signals facilitates system implementation using application-specific integrated circuits (ASICs) and is not as restricted in voltage level and speed. At the same time, the benefits and applications of fully-analog excitation signals (e.g., acoustic holography, beam superposition, signal-to-noise ratio (SNR) improvements, suppression of parasitic modes, increased material penetration, potential for coded pulsing algorithms and suppression of side lobes in ultrasonic field) can still be achieved with multi-level square wave excitation signals.

Abstract: An ultrasonic sensor assembly for testing a pipe includes a first and second transducer rings attached to the pipe and spaced apart along a length of the pipe. The first transducer ring includes a plurality of transmitters for transmitting a wave, such as a non-dispersive guided wave. The first transducer ring transmits the wave along the pipe. The second transducer ring includes a plurality of receivers for receiving the wave. A relative position of the first transducer ring with respect to a circumferential position of the second transducer ring is determined based on characteristics of the wave received by the second transducer ring. A method of positioning the ultrasonic sensor assembly on the pipe is also provided.

Abstract: An ultrasonic sensor assembly for testing a pipe includes a first and second transducer rings attached to the pipe and spaced apart along a length of the pipe. The first transducer ring includes a plurality of transmitters for transmitting a wave, such as a non-dispersive guided wave. The first transducer ring transmits the wave along the pipe. The second transducer ring includes a plurality of receivers for receiving the wave. A relative position of the first transducer ring with respect to a circumferential position of the second transducer ring is determined based on characteristics of the wave received by the second transducer ring. A method of positioning the ultrasonic sensor assembly on the pipe is also provided.

Abstract: An ultrasonic sensor assembly for testing a pipe includes a first and second transducer rings attached to the pipe and spaced apart along a length of the pipe. The first transducer ring includes a plurality of transmitters for transmitting a wave, such as a non-dispersive guided wave. The first transducer ring transmits the wave along the pipe. The second transducer ring includes a plurality of receivers for receiving the wave. A relative position of the first transducer ring with respect to a circumferential position of the second transducer ring is determined based on characteristics of the wave received by the second transducer ring. A method of positioning the ultrasonic sensor assembly on the pipe is also provided.

Abstract: An ultrasonic sensor assembly detects a characteristic of a pipe. The ultrasonic sensor assembly includes first and second transducer rings spaced apart along a length of the pipe. Each of the first and second transducer rings can transmit a first wave longitudinally along the pipe and receive a reflection of the transmitted first wave from the characteristic. The first transducer ring can use results related to the reflection of the transmitted first wave to guide a second wave along the pipe that is received by the second transducer ring. Methods of detecting a characteristic of the pipe are also provided.

Abstract: Systems and methods are disclosed herein in which multi-level square wave excitation signals are used instead of or in addition to fully-analog excitation signals to drive an array of transceiver elements to create a sound field. Use of multi-level square wave excitation signals produces acceptable transceiver output with reduced complexity, cost, and/or power consumption as compared with use of fully-analog excitation signals. In addition, use of such signals facilitates system implementation using application-specific integrated circuits (ASICs) and is not as restricted in voltage level and speed. At the same time, the benefits and applications of fully-analog excitation signals (e.g., acoustic holography, beam superposition, signal-to-noise ratio (SNR) improvements, suppression of parasitic modes, increased material penetration, potential for coded pulsing algorithms and suppression of side lobes in ultrasonic field) can still be achieved with multi-level square wave excitation signals.

Abstract: An ultrasonic sensor assembly for testing a pipe includes a first and second transducer rings attached to the pipe and spaced apart along a length of the pipe. The first transducer ring includes a plurality of transmitters for transmitting a wave, such as a non-dispersive guided wave. The first transducer ring transmits the wave along the pipe. The second transducer ring includes a plurality of receivers for receiving the wave. A relative position of the first transducer ring with respect to a circumferential position of the second transducer ring is determined based on characteristics of the wave received by the second transducer ring. A method of positioning the ultrasonic sensor assembly on the pipe is also provided.

Abstract: An ultrasonic sensor assembly detects a characteristic of a pipe. The ultrasonic sensor assembly includes first and second transducer rings spaced apart along a length of the pipe. Each of the first and second transducer rings can transmit a first wave longitudinally along the pipe and receive a reflection of the transmitted first wave from the characteristic. The first transducer ring can use results related to the reflection of the transmitted first wave to guide a second wave along the pipe that is received by the second transducer ring. Methods of detecting a characteristic of the pipe are also provided.

Abstract: A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

Abstract: A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

Abstract: An ultrasound inspection system is provided for inspecting an object. The inspection system includes an ultrasound probe configured to scan the object and acquire a plurality of ultrasound scan data. The inspection system further includes a processor coupled to the ultrasound probe and configured to apply a transfer function to the ultrasound scan data to compensate for distortion of a plurality of ultrasound signals through the object and thereby generate a plurality of compensated ultrasound scan data, and to process the compensated ultrasonic scan data to characterize a feature in the object.

Abstract: A piezoelectric sensing device is described for measuring material thickness of target such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device comprises a substrate such as a flexible circuit material, a piezoceramic element, and a solder layer disposed therebetween. These features are arranged in manner that provides a low-profile measurement device suitable for high-temperature applications such as those applications in which the temperature exceeds 120° C. Embodiments of the piezoelectric sensing device can be configured for use as stand-alone units separately located on the target or for use as a string of sensing elements coupled together by way of the flexible circuit material.

Abstract: An ultrasonic transducer comprises a transmitting element for transmitting an ultrasonic signal at a fundamental frequency and a receiving element adaptable for multiple receive water path operations and for receiving ultrasonic signals at the fundamental frequency and harmonics of the fundamental frequency.

Abstract: An ultrasound inspection system is provided for inspecting an object. The inspection system includes an ultrasound probe configured to scan the object and acquire a plurality of ultrasound scan data. The inspection system further includes a processor coupled to the ultrasound probe and configured to apply a transfer function to the ultrasound scan data to compensate for distortion of a plurality of ultrasound signals through the object and thereby generate a plurality of compensated ultrasound scan data, and to process the compensated ultrasonic scan data to characterize a feature in the object.

Abstract: An acoustic stack for ultrasonic transducers comprising a backing block, flexible printed circuit board, piezoelectric ceramic layer, and acoustic matching layer. The various components of the acoustic stack are bonded together using an adhesive material and high pressure in a lamination process. The piezoelectric ceramic layer is manufactured to provide electrical and acoustic isolation without the need for dicing through multiple layers of the acoustic stack. A flex circuit provides the necessary electrical connections to the electrically isolated electrodes of the piezoelectric ceramic layer.

Abstract: A method for fabricating an ultrasound transducer structure is disclosed. The method includes performing the steps of forming a functional layer, including an ultrasound transducer material and a photopolymer, and exposing a plurality of selected regions of the functional layer to a programmable light pattern to cure the selected regions of the functional layer to form polymerized ultrasound transducer material regions, repeatedly. The method further includes selectively removing unexposed regions of the functional layer to obtain a green component, and sintering the green component to obtain the sensing structure. A system for making at least one piezoelectric element is also disclosed.

Abstract: An adhesive composition is provided which effectively bonds a sensor to a surface having a temperature up to approximately 250° C. The adhesive composition comprises an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin. The invention also provides a method of preparing an adhesive composition comprising blending an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin, wherein the composition is capable of effectively bonding a sensor to a surface having a temperature up to approximately 250° C. The invention further provides a method of bonding a sensor to a surface comprising the steps of applying an adhesive composition to a first surface of the sensor or to a surface area of an object to be monitored, the adhesive composition comprising an epoxy compound and a latent cationic cure catalyst effective to cure the epoxy resin.

Abstract: The invention provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a first surface of the sensor. The first surface of the sensor is contacted with a surface of an object to be monitored, wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. The invention also provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a surface area of an object to be monitored. The first surface of a sensor is contacted with the object surface area, wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250° C.

Abstract: A system for monitoring at least one of a resin infusion process and a composite cure cycle of a composite article is provided. The system includes an ultrasonic transmitter configured to deliver an acoustic wave to a resin-infused fiber preform and an ultrasonic receiver configured to receive the acoustic wave propagated through the resin-infused fiber preform. The system also includes a processor configured to estimate at least one parameter using the received acoustic wave and to use the at least one parameter to determine an extent to which at least one resin has infused into the resin-infused fiber preform.