Abstract: The invention relates to on-demand debondable pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesives and laminating adhesives are applied onto a substrate to form a bond, and upon exposure to electron beam or UV light energy source, the adhesive can dissociate from the substrate. The debondable pressure sensitive adhesives and laminating adhesives are particularly suitable for recycling in a circular economy.

Abstract: A headlamp assembly includes, among other things, a lamp housing, a headlamp adjuster system within the lamp housing, and an access control member moveable from an accessing position to a covering position while coupled to the lamp housing. The headlamp adjustor assembly is accessible through an aperture in the lamp housing when the access control member is in the accessing position. The headlamp adjustor assembly is inaccessible through the aperture in the access control member when the access control member is in the covering position.

Abstract: A sidemarker light assembly includes a support bracket, a light blade carried on the support bracket and a light source in communication with the first end of the light blade. Light from that light source is then transmitted through the light blade and emitted from a second end of the light blade to provide a sidemarker indication. A motor vehicle light assembly incorporating the sidemarker light assembly is also disclosed.

Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

Abstract: A sidemarker light assembly includes a support bracket, a light blade carried on the support bracket and a light source in communication with the first end of the light blade. Light from that light source is then transmitted through the light blade and emitted from a second end of the light blade to provide a sidemarker indication. A motor vehicle light assembly incorporating the sidemarker light assembly is also disclosed.

Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

Abstract: A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.

Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

Abstract: A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.

Abstract: A multiprocessor computer system includes a plurality of processor nodes coupled by a direct processor interconnect network, and a plurality of processor nodes coupled by an indirect processor interconnect network. A bridge directly couples the direct processor interconnect network and the indirect processor interconnect network.

Abstract: A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

Abstract: Packaging bags having preapplied thereon a reactivatable adhesive.

Abstract: A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

Abstract: A method of assembling a high pressure sensor with knurl press-fit includes a first step of providing a pressure port having a material with a first hardness and a housing having a material with a second hardness less than the first hardness. The pressure port has a mounting boss and the housing has a receptacle for receiving the mounting boss. A next step includes configuring the mounting boss of the pressure port with knurls thereon. A next step includes pressing the mounting boss of the pressure port into the receptacle of the housing along a direction of the axis such that the knurls deform the receptacle of the housing to conform about the knurls to define a semi-rigid mount.

Abstract: An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

Abstract: A process for applying heat shrink film to containers comprising the steps of a) coating at least a portion of a heat shrinkable but unshrunken film segment with a reactive hot melt polyurethane adhesive having a free isocyante content greater than 2% and a viscosity less than 3000 cps at 225.degree. F.; b) applying the film to the longitudinal surface of the container; and, c) subjecting the container to heat to shrink the film onto the container so as to permanently affix it thereto.

Abstract: A solvented polyurethane adhesive composition comprising 20 to 40% by weight of diphenylmethane diisocyanate, 0.5 to 4.0% by weight of a caprolactone triol, 40 to 75% by weight of a neopentyl adipate ester diol, 0 to 10% by weight of at least one polypropylene oxide diol, and a functionally effective amount of a catalyst therefor.