Abstract: The addition of an array of transistors through areas of the circuit where active devices normally don't exist, such as under routing channels. By connecting this array of transistors such that the gates are tied to one power supply and the sources and drains to another, the transistors act as bypass capacitors between the power supplies and act to reduce noise on the supplies. Also, the transistors may later be reconnected through changes in the design to form diodes, inverters, buffers, or other logic gates to allow changes to the circuit late in the design cycle.

Abstract: The addition of an array of transistors through areas of the circuit where active devices normally don't exist, such as under routing channels. By connecting this array of transistors such that the gates are tied to one power supply and the sources and drains to another, the transistors act as bypass capacitors between the power supplies and act to reduce noise on the supplies. Also, the transistors may later be reconnected through changes in the design to form diodes, inverters, buffers, or other logic gates to allow changes to the circuit late in the design cycle.

Abstract: A hip brace that dramatically reduces the pain and discomfort associate with hip degeneration. In one embodiment, the hip brace includes a girdle adapted to be wrapped around the user's waist, and a support member including an upper portion connected to the girdle and a lower portion adapted to provide lateral and upward support to the user's buttock. The lower portion is thicker (e.g., at least three times thicker) than said upper portion to facilitate support of the user's buttock. In order to provide additional support, the hip brace can further include a formed spring support connected to the support member. Preferably, the hip brace further includes at least two support straps connecting the lower portion with the girdle. In a preferred embodiment, the support member includes an inflatable member and an inflater connected to the inflatable member.

Abstract: A system for generating an analog regulating voltage to be supplied to one or more circuit elements on an integrated circuit. The circuit elements have operational characteristics that are voltage dependent and the analog regulating voltage having the a property of changing with temperature, power supply voltage, and manufacturing process variations so as to substantially eliminate the effects of such variations on the operational characteristics of the circuit elements.

Abstract: The present invention is a time vernier providing fine timing control of an input signal having coarse timing edges. The time vernier comprises a receiving means for receiving a value representing a desired time delay to be added to the coarse timing edge input. The desired time delay may have both fine and coarse delay aspects. The time vernier also comprises a first decoding means for decoding the fine delay aspect and generating fine delay control signals, as well as a second decoding means for decoding a coarse delay aspect and generating coarse delay control signals. A delay line is also included in the time vernier which has inputs to receive the input signal having coarse timing edges, the fine and coarse delay control signals, and a control voltage which automatically adjusts with temperature and power supply variations, so as to provide for temperature and power supply compensation. The delay line combines the fine and coarse delay signals to provide an output signal with fine timing edges.

Abstract: A method for fabricating a solid state semiconductor gas sensor and the semiconductor sensor itself for use in equipment detecting small amounts of H.sub.2 S. The method of sensor fabrication comprises spray deposition of a mixture of metal oxides mixed together with various metal and non-metal materials which serve in the finished product as activators, dopants, and/or film binder materials, and including in suspension a molecular sieve material, for enhancing porosity on a scale of molecular dimensions in the finished sensor. All of the foregoing materials are suspended in a suitable solution and preferably sprayed onto a heated insulating substrate to form the finished product. The example sensor, capable of selective detection of H.sub.2 S in air and a sensitivity of less than 1 PPM (part per million), is comprised of a platinum activated alumina, tin oxide, and zeolite molecular sieve material.

Abstract: A semiconductor gas sensor for use in equipment for detecting small amounts of H.sub.2 S. The method of sensor fabrication comprises spray deposition of a mixture of metal oxides mixed together with various metal and non-metal materials which serve in the finished product as activators, dopants, and/or film binder materials, and including in suspension a molecular sieve material, for enhancing and defining porosity on a scale of molecular dimensions in the finished sensor. All of the foregoing materials are suspended in a suitable solution and preferably sprayed onto a heated insulating substrate to form the finished product. The example sensor, capable of selective detection of H.sub.2 S in air and a sensitivity of less than 1 PPM (part per million), is comprised of a platinum activated alumina, tin oxide, and zeolite molecular sieve material.