Abstract: A method of obtaining polished semiconductor wafers with a polishing device includes conducting polishing of a first batch of semiconductor wafers with the polishing device at a turntable rotational speed to obtain a first batch of polished semiconductor wafers, experiencing a downtime following completion of the polishing of the first batch of semiconductor wafers with the polishing device, adjusting the turntable rotational speed for polishing of a next consecutive batch of semiconductor wafers, the adjustment being based upon a length of the downtime between the completion of the polishing of the first batch of semiconductor wafers and a start of polishing of the next consecutive batch of semiconductor wafers, and conducting polishing of the next consecutive batch of semiconductor wafers with the polishing device at the adjusted turntable rotational speed to obtain a next consecutive batch of semiconductor wafers.