Abstract: A control circuit is configured to connect to a cross-point memory array in which each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET in a conductive state while the nMOSFET is in a non-conductive state. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may be in a conductive state.

Abstract: The present disclosure relates to delivery devices for transcatheter stented prosthesis loading, delivery and implantation. The delivery devices provide a loaded delivery state in which the stented prosthesis is loaded and compressed over the delivery device. The compression of the stented prosthesis can be adjusted with one or more elongate tension members, which extend around the stented prosthesis and proximately to an actuation and release assembly that can be provided as part of a handle assembly. The delivery device can be manipulated to adjust tension in the tension members to permit the stented prosthesis to compress, self-expand, and ultimately release from the shaft assembly. In some embodiments, the tension in one or more tension members is adjusted with one or more actuation and release assemblies.

Abstract: Technology is disclosed for improving read margin in a cross-point memory array. Drive transistors pass a read and write currents to the cross-point memory array. The read current charges a selected word line to turn on a threshold switching selector of a selected memory cell. While the threshold switching selector is on, the current (read or write) passes through the selected memory cell. The memory system applies a smaller overdrive voltage to the drive transistor when the drive transistor is passing the read current than when the drive transistor is passing the write current. A smaller overdrive voltage increases the resistance of the drive transistor which improves read margin. Increasing the resistance of the drive transistor increases the resistance seen by the threshold switching selector in the selected memory cell, which reduces the Ihold of the threshold switching selector. Reducing Ihold of the threshold switching selector improves read margin.

Abstract: A circuit is provided that includes a first transistor having a first terminal, a second terminal and a third terminal, and a second transistor comprising a first terminal, a second terminal and a third terminal. The first terminal of the first transistor comprises an input terminal of the circuit, the second terminal of the first transistor is coupled to a power supply bus, and the first transistor conducts a first current. The first terminal of the first transistor comprises an output terminal of the circuit, the second terminal of the second transistor is coupled to the power supply bus, and the third terminal of the second transistor is coupled to the third terminal of the first transistor. The second transistor conducts a second current proportional to the first current substantially independent of distance between the first transistor and the second transistor.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: A control circuit is configured to connect to a cross-point memory array in which each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET in a conductive state while the nMOSFET is in a non-conductive state. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may be in a conductive state.

Abstract: Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the selector is turned on. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may turned on while the pMOSFET is turned off. The nMOSFET provides a higher resistance in place of the decreased resistance of the pMOSFET to amplify a signal at a sense circuit to allow accurate sensing of the voltage across the memory cell.

Abstract: Concurrent access of multiple memory cells in a cross-point memory array is disclosed. In one aspect, a forced current approach is used in which, while a select voltage is applied to a selected bit line, an access current is driven separately through each selected word line to concurrently drive the access current separately through each selected memory cell. Hence, multiple memory cells are concurrently accessed. In some aspects, the memory cells are accessed using a self-referenced read (SRR), which improves read margin. Concurrently accessing more than one memory cell in a cross-point memory array improves bandwidth. Moreover, such concurrent accessing allows the memory system to be constructed with fewer, but larger cross-point arrays, which increases array efficiency. Moreover, concurrent access as disclosed herein is compatible with memory cells such as MRAM which require bipolar operation.

Abstract: Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the selector is turned on. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may be turned on while the pMOSFET remains on. The nMOSFET adds a resistance which offsets a decreased resistance of the pMOSFET to allow accurate sensing of the voltage across the memory cell.

Abstract: Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the selector is turned on. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may turned on while the pMOSFET is turned off. The nMOSFET provides a higher resistance in place of the decreased resistance of the pMOSFET to amplify a signal at a sense circuit to allow accurate sensing of the voltage across the memory cell.

Abstract: Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the selector is turned on. Further, when reading the selected memory cell, the parallel nMOSFET of the first conductive line may be turned on while the pMOSFET remains on. The nMOSFET adds a resistance which offsets a decreased resistance of the pMOSFET to allow accurate sensing of the voltage across the memory cell.

Abstract: In a memory array with a cross-point structure, at each cross-point junction a programmable resistive memory element, such as an MRAM device, is connected in series with a threshold switching selector, such as an ovonic threshold switch. In a two-layer cross-point structure with such memory cells, the MRAM devices in one layer are inverted relative to the MRAM devices in the other layer. This can allow for the transient voltage spike placed across the MRAM device when the threshold switching selector first turns on in a sensing operation to dissipate more rapidly, reducing the risk of changing a stored data state before it can be sensed.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for memory array addressing. An addressing circuit is configured to receive an address for an operation on an array of multiple memory regions. An address includes a row address and a column address both multiplexed into the address and received with an activate command for an operation. A row buffer for an array of multiple memory regions is configured to store data identified by multiplexed row and column addresses from the multiple memory regions. Data of an operation is selected from a row buffer based on a second address received with a subsequent command for the operation.

Abstract: Apparatuses and techniques are described for programming phase change memory cells while avoiding a clamp condition in transistors which are used for biasing a word line and bit line when the word line and bit line are unselected for a write operation. The transistors may be connected in parallel with the word line and bit line. During a write operation, a current source is connected to a selected word line and a voltage control circuit is connected to the selected bit line. The voltage control circuit can include a capacitor or a voltage driver, for example. The capacitor accumulates charge, or the voltage driver applies an increasing ramp voltage to the bit line, to increase the voltage of the bit line and word line during the write operation and to avoid the clamp condition.

Abstract: Apparatuses and techniques are described for programming phase change memory cells while avoiding a clamp condition in transistors which are used for biasing a word line and bit line when the word line and bit line are unselected for a write operation. The transistors may be connected in parallel with the word line and bit line. During a write operation, a current source is connected to a selected word line and a voltage control circuit is connected to the selected bit line. The voltage control circuit can include a capacitor or a voltage driver, for example. The capacitor accumulates charge, or the voltage driver applies an increasing ramp voltage to the bit line, to increase the voltage of the bit line and word line during the write operation and to avoid the clamp condition.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for memory array addressing. An addressing circuit is configured to receive an address for an operation on an array of multiple memory regions. An address includes a row address and a column address both multiplexed into the address and received with an activate command for an operation. A row buffer for an array of multiple memory regions is configured to store data identified by multiplexed row and column addresses from the multiple memory regions. Data of an operation is selected from a row buffer based on a second address received with a subsequent command for the operation.

Abstract: An abradable liner suitable for a gas turbine engine fan stage, comprising a plurality of abradable layers that are bonded together, wherein at least one visual indicator is embedded in the plurality of abradable layers, the visual indicators can be coloured strips of material and may be at a given depth, and may be in an independent element or layer located in between other layers.

Abstract: An abradable liner for a gas turbine engine fan stage, comprising: a plurality of abradable layers bonded together, wherein at least one visual indicator is embedded in the plurality of abradable layers