Patents by Inventor James P. Becker

James P. Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • On-wafer packaging for RF-MEMS
    Patent number: 6696645
    Abstract: An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first silicon wafer. A micro-electro-mechanical device is provided and coupled to the top surface of the first silicon wafer. An electrical feed line then extends along the bottom surface of the first silicon wafer and an electrical interconnect electrically couples the micro-electro-mechanical device and the electrical feed line through the bore.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: February 24, 2004
    Assignee: The Regents of the University of Michigan
    Inventors: Alexandros Margomenos, Katherine J. Herrick, James P. Becker, Linda P. B. Katehi
  • On-wafer packaging for RF-MEMS
    Publication number: 20030209357
    Abstract: An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first silicon wafer. A micro-electro-mechanical device is provided and coupled to the top surface of the first silicon wafer. An electrical feed line then extends along the bottom surface of the first silicon wafer and an electrical interconnect electrically couples the micro-electro-mechanical device and the electrical feed line through the bore.
    Type: Application
    Filed: May 8, 2002
    Publication date: November 13, 2003
    Inventors: Alexandros Margomenos, Katherine J. Herrick, James P. Becker, Linda P.B. Katehi