Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and excellent thermal stability and protective properties.

Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and thermal stability and protective properties.

Abstract: A metal-polymer composite comprises a metal and substrate layer disposed on the metal, wherein the substrate layer is formed from a curable thermosetting resin system comprising a curing agent and about 0.1 to 100 weight percent (wt %), preferably about 0.2 to about 80 wt %, more preferably about 0.4 to about 60 wt %, and most preferably about 2 to about 40 wt % of an episulfide, and further wherein the resin system is cured in the presence of the metal. In another embodiment, the thermosetting system comprises about 0.1 to about 50 wt %, preferably about 1 to about 40 wt % and more preferably about 2 to about 30 wt % of at least one episulfide resin, at least one epoxy resin reactive therewith, and a curing agent, wherein the resin system is cured in the presence of a metal, such as a layer of copper or gold. A preferred epoxy resin is the diglycidyl ether of bisphenol A, which is the condensation product of bisphenol A and epichlorohydrin (hereinafter abbreviated “DGEBA”).

Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their formation by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and excellent thermal stability and protective properties.

Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their formation by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and excellent thermal stability and protective properties.

Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their formation by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and excellent thermal stability and protective properties.

Abstract: A composition and method is described for providing conformal protective or decorative polymer coatings on metals such as aluminum, copper, iron, steel, zinc, and their by dip autopolymerization. In accordance with the present invention, an acidic solution of organic monomer undergoes autopolymerization upon contact with a metal substrate, thereby forming a polymeric coating on the substrate. The method comprises providing the acidic monomer solution, dipping the metal substrate to be coated for a prescribed period of time depending on the thickness of the coating desired, and then removing the substrate from the solution. Importantly, the polymerization requires no application of external driving force, such as thermal or electrical energy. The coatings thus formed are up to 50 microns thick, and conform to the shape of the substrate. These coatings further have uniform thickness, and excellent thermal stability and protective properties.

Abstract: A polymeric coupling agent for chemically linking a scratch resistant coating composition to a polycarbonate substrate is disclosed. The agent is a product of the reaction between polycarbonate and 3-glycidoxypropyltrimethoxysilane (GPS) in the presence of a quaternary ammonium salt. The reaction in the solid state produces a GPS-modified polycarbonate having a bimodal molecular weight distribution which is effective in promoting the adhesion of a scratch resistant coating to a polycarbonate substrate.

Abstract: In accordance with the present invention, electropolymerization in a substantially aqueous solution is used to form thick (e.g. greater than 2 microns or 30 weight %) and thermally stable coatings of thermoplastic materials onto electrically conductive filler materials (e.g. rods, plates, fibers). In a first preferred embodiment, the thick thermoplastic matrix comprises a copolymer of 3-carboxyphenyl meleimde and styrene. In a second preferred embodiment, cyclic (and preferably aromatic) N-substituted methacrylamide monomers are electropolymerized onto electrically conductive (e.g., graphite) filler (e.g., fibers, plates, film or cloth) to form a novel polymer composite exhibiting high Tg as well as a controlled degree of cross-linking which can prevent flow at high temperature. This invention is particularly will suited for direct preparation of thermoplastic prepregs containing commercially available bundles of graphite fibers.

Abstract: In accordance with the present invention, electropolymerization in a substantially aqueous solution is used to form thick (e.g. greater than 2 microns or 30 weight %) and thermally stable coatings of thermoplastic materials onto electrically conductive filler materials (e.g. rods, plates, fibers). In a first preferred embodiment, the thick thermoplastic matrix comprises a copolymer of 3-carboxyphenyl maleimide and styrene. In a second preferred embodiment, cyclic (and preferably aromatic) N-substituted methacrylamide monomers are electropolymerized onto electrically conductive (e.g., graphite) filler (e.g., fibers, plates, film or cloth) to form a novel polymer composite exhibiting high Tg as well as a controlled degree of cross-linking which can prevent flow at high temperature. This invention is particularly well suited for direct preparation of thermoplastic prepregs containing commercially available bundles of graphite fibers.

Abstract: Cyclic (and preferably aromatic) N-substituted methacrylamide monomers are electropolymerized onto electrically conductive (e.g., graphite) filler (e.g., fibers, plates, film or cloth) to form a novel polymer composite exhibiting high Tg as well as a controlled degree of cross-linking which can prevent flow at high temperature.

Abstract: In accordance with the present invention, electropolymerization in a substantially aqueous solution is used to form thick (e.g. greater than 2 microns or 30 weight %) and thermally stable coatings of thermoplastic materials onto electrically conductive filler materials (e.g. rods, plates, fibers). In a preferred embodiment, the thick thermoplastic matrix comprises a copolymer of 3-carboxyphenyl maleimide and styrene. This invention is particularly well suited for direct preparation of thermoplastic prepregs containing commercially available bundles of graphite fibers. These prepregs are then molded under heat and pressure so as to form a thermoplastic matrix composite with good fiber distribution, uniformity and high temperature resistance.

Abstract: A polycarbonate-epoxy polymer and method of making the same is presented. In accordance with the present invention, epoxide groups of epoxy resins react with in-chain carbonate groups of a polycarbonate in the presence of a catalyst to form a polycarbonate-epoxy polymer. When diepoxides and polycarbonates are reacted, the product produced is a three-dimensional network of chains cross-linked with carbonate groups. The cross-link density is controlled by adjusting the epoxy-carbonate ratio. The preferred catalyst comprises quarternary ammonium salts with tertiary amine and alkoxide catalyst being less preferred.

Abstract: A coupling agent for chemically linking metal substrates to thermoset polymers is composed of a hydrophobic polymer backbone having functional groups attached thereto at spaced intervals, the functional groups having the ability to form chemical bonds to both the metal substrate and the thermosetting polymeric resin. In a preferred embodiment, the hydrophobic polymeric coupling agent comprises mercaptoester functional groups placed along a strong, hydrophobic polymeric backbone. This polymeric backbone preferably comprises polyethylene resulting in an ethylene mercaptoester (EME) copolymer.

Abstract: The present invention is directed to a method for improving the adhesion of epoxy resins to steel substrates which comprises first removing the oxide surface layer, preferably by chemical means, and then pretreating the substrate with a solution of at least one coupling agent selected from the group consisting of .beta.-diketones and mercaptoesters. The invention also provides a method for improving the adhesion of epoxy resins to steel substrates by pretreating with citric acid or a salt thereof.

Abstract: The present invention is directed to a method for improving the adhesion of epoxy resins to copper substrates which comprises pretreating the copper substrate with a solution of a suitable pretreatment compound such as a benzotriazole, benzothiazole, substituted benzotriazoles, etc.