Abstract: Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate having an outer perimeter, an opening inside of the outer perimeter, and a gap extending between the opening and the outer perimeter. The lift plate includes annular rims of different inner diameters and that are configured to respectively support the first and second workpieces.

Abstract: Apparatus and methods for handling workpieces in a processing system. The workpiece vertical lift mechanism (200), which is disposed inside a process chamber (40) of the processing system, is adapted to transfer a workpiece (55) to and from a pedestal portion (286) of an electrode (24). The pedestal portion (286) is configured to support the workpiece (55) during processing. The workpiece vertical lift mechanism (200) including a workpiece fixture (290) movable relative to the pedestal portion (286) between a first position in which the workpiece fixture (290) holds the workpiece (55) in a non-contacting relationship with the pedestal portion (286) and a second position in which the pedestal portion (286) projects above workpiece fixture (290) so as to transfer the workpiece (55) from the workpiece fixture (290) to the pedestal portion (286).

Abstract: Apparatus and methods for plasma processing workpieces of different diameters. The apparatus includes a lift plate having an outer perimeter, an opening inside of the outer perimeter, and a gap extending between the opening and the outer perimeter. The lift plate includes annular rims of different inner diameters and that are configured to respectively support the first and second workpieces.

Abstract: Apparatus and methods for handling workpieces in a processing system. The workpiece vertical lift mechanism (200), which is disposed inside a process chamber (40) of the processing system, is adapted to transfer a workpiece (55) to and from a pedestal portion (286) of an electrode (24). The pedestal portion (286) is configured to support the workpiece (55) during processing. The workpiece vertical lift mechanism (200) including a workpiece fixture (290) movable relative to the pedestal portion (286) between a first position in which the workpiece fixture (290) holds the workpiece (55) in a non-contacting relationship with the pedestal portion (286) and a second position in which the pedestal portion (286) projects above workpiece fixture (290) so as to transfer the workpiece (55) from the workpiece fixture (290) to the pedestal portion (286).

Abstract: Apparatus and methods for handling workpieces in a processing system. The workpiece vertical lift mechanism (200), which is disposed inside a process chamber (40) of the processing system, is adapted to transfer a workpiece (55) to and from a pedestal portion (286) of an electrode (24). The pedestal portion (286) is configured to support the workpiece (55) during processing. The workpiece vertical lift mechanism (200) including a workpiece fixture (290) movable relative to the pedestal portion (286) between a first position in which the workpiece fixture (290) holds the workpiece (55) in a non-contacting relationship with the pedestal portion (286) and a second position in which the pedestal portion (286) projects above workpiece fixture (290) so as to transfer the workpiece (55) from the workpiece fixture (290) to the pedestal portion (286).

Abstract: An apparatus for processing a substrate with a plasma. The apparatus includes first and second electrodes positioned with a spaced apart relationship. A separating ring has a vacuum-tight engagement with confronting surfaces of the first electrode and the second electrode to define an evacuatable processing region therebetween. Communicating with the processing region is a process gas port for introducing a process gas to the processing region. The processing region may be evacuated through a vacuum port defined in one of the first and second electrodes to a pressure suitable for exciting a plasma from the process gas in the processing region when the first and second electrodes are powered.

Abstract: Apparatus and methods for handling workpieces in a processing system. The workpiece vertical lift mechanism (200), which is disposed inside a process chamber (40) of the processing system is adapted to transfer a workpiece (55) to and from a pedestal portion (286) of an electrode (24). The pedestal portion (286) is configured to support the workpiece (55) during processing. The workpiece vertical lift mechanism (200) including a workpiece fixture (290) movable relative to the pedestal portion (286) between a first position in which the workpiece fixture (290) holds the workpiece (55) in a non-contacting relationship with the pedestal portion (286) and a second position in which the pedestal portion (286) projects above workpiece fixture (290) so as to transfer the workpiece (55) from the workpiece fixture (290) to the pedestal portion (286).

Abstract: Plasma processing system and methods for stripping the buffer and, optionally, removing the cladding from an optical fiber. The plasma processing system includes a holder capable of holding one or more optical fibers such that a mid-span portion of each optical fiber is exposed to a plasma generated within a processing chamber of the system and the ends of each optical fiber are unaffected by the plasma treatment. Tapered transition zones are created between the plasma-treated portion of the optical fiber and the shielded ends. Treatment may be accomplished using a plasma containing atomic and molecular radicals and ions of fluorine and oxygen.

Abstract: A plasma treatment system in which untreated workpieces are serially received one at a time on an infeed table but stored in parallel on the infeed table. The untreated workpieces are transferred simultaneously, in parallel, into a plasma treatment chamber. Thereafter, treated workpieces are transferred simultaneously, in parallel, out of the plasma treatment chamber onto an outfeed table; and the outfeed table serially discharges the treated workpieces one at a time from the outfeed table.

Abstract: Plasma processing system and methods for stripping the buffer and, optionally, removing the cladding from an optical fiber. The plasma processing system includes a holder capable of holding one or more optical fibers such that a mid-span portion of each optical fiber is exposed to a plasma generated within a processing chamber of the system and the ends of each optical fiber are unaffected by the plasma treatment. Tapered transition zones are created between the plasma-treated portion of the optical fiber and the shielded ends. Treatment may be accomplished using a plasma containing atomic and molecular radicals and ions of fluorine and oxygen.

Abstract: A plasma treatment system in which untreated workpieces are serially received one at a time on an infeed table but stored in parallel on the infeed table. The untreated workpieces are transferred simultaneously, in parallel, into a plasma treatment chamber. Thereafter, treated workpieces are transferred simultaneously, in parallel, out of the plasma treatment chamber onto an outfeed table; and the outfeed table serially discharges the treated workpieces one at a time from the outfeed table.