Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes.

Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes.

Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes.

Abstract: A conventional circular friction disk having a metal backing plate and outer layer of friction material is replaced by a disk having a plurality of straight outer side edges joined by curved edges, in order to effect material savings in the manufacturing process, and without significant loss in performance.

Abstract: A geared neutral continuously variable transmission has a variable ratio belt drive, a fixed ratio drive and a planetary gear set. The fixed ratio drive is selectively connectible with the transmission input by a friction clutch and with the planetary gear set by another friction clutch. A one-way clutch is disposed in parallel drive relation with the other friction clutch. When the fixed drive ratio is not transmitting torque, it can be effectively removed from the drive path to increase efficiency and reduce noise generation by disengaging the friction clutches.