Abstract: Systems and methods for reconstructing the state of a market are provided. Orders are arranged as a non-indexed collection of orders and may be stored in the cache memory of a processor. The physical locations of orders stored in the memory may correspond to the order in which they were received at a match engine. A computer device simulates the processing of orders between any time periods to reconstruct the activity state of an entity across a trading platform and one or more order books.

Abstract: The present invention discloses a system for protecting a base station antenna that includes an antenna mounted to a platform base. The platform base can be raised and lowered depending upon an amount of pressure in a pressure chamber. A pressure generator can increase the amount of pressure in the pressure chamber. A depressurization valve can decrease the amount of pressure in the pressure chamber. A protective housing can protect the antenna from environmental conditions. When in a deactivated state, the antenna can be lowered into the protective housing. When in an operational state, at least a portion of the antenna can be raised above the protective housing so that the antenna can send and receive radio frequency signals.

Abstract: A data collection application includes a collection document having a first code portion configured to format the document, at least one information input configured to receive an input wherein the at least one information input is defined by the first code portion, and a second code portion stored within the collection document and configured to include the information provided via the at least one information input. The data collection document further includes an archival routine configured to create a second collection document based on the second code portion and the information provided via the at least one information input.

Abstract: The present invention provides an Al—Zn—Mg—Cu casting alloy that provides high strength for automotive and aerospace applications and optimized stress corrosion cracking resistance in highly corrosive and tensile environments. The inventive alloy composition includes about 3.5 wt. % to about 5.5 wt. % Zn; about 1.0 wt. % to about 3.0 wt. % Mg; about 0.5 wt. % to about 1.2 wt. % Cu; less than about 1.0 wt. % Si; less than about 0.30 wt. % Mn; less than about 0.30 wt. % Fe; and a balance of Al and incidental impurities.

Abstract: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator which is not a peroxide, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C.

Abstract: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C.

Abstract: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, an olefinicially unsaturated monomer component including at least one polyolefinically unsaturated monomer curable by actinic radiation, at least one photoinitiator, at least one organic peroxide, and a heat activated curing agent for epoxides. The compositions have a viscosity less than about 2000 centipoise (cps) and are capable of retaining this viscosity for at least about 2 hours at a temperature of from about ambient temperature to about 60.degree. C. The resins are capable of being immobilized by actinic radiation exposure and further heat cured without substantial resin drip. One or more organic peroxides are employed, selected from the group of organic peroxides having 10 hour decomposition half lives at temperatures of from about 50.degree. C. to less than about 104.degree. C.

Abstract: Polymerizable acrylic monomer adhesive systems comprising thirty to eighty percent by weight powdered aluminum filler material are disclosed. More specifically, the adhesive compositions comprise at least one polymerizable acrylate monomer system; an effective amount for initiation of a free radical initiator; and elemental (atomized) aluminum metal powder or powdered alumina.

Abstract: A radio frequency device comprising a signal processing means joined to electromagnectic transmission means, and latently susceptible, at the junction of the signal processing means and the electromagnetic transmission means, to adverse operating effects such as electromagnetic interference (EMI), and/or radio frequency leakage. At this junction is disposed a layer of a material which is blockingly effective against the adverse operating effects, and has a volumetric resistivity of from about 10.sup.-3 to about 2,000 ohm-centimeter.Also disclosed is a corresponding method of assembling a radio frequency device of such type.The invention has utility in application to devices such as impedance matching devices, impedance coupling devices, ground protection devices, radar transceivers, and signal splitters, a prefered application being to cable television junction boxes.

Abstract: Polymerizable acrylic monomer adhesive systems comprising thirty to eighty percent by weight powdered aluminum filler material are disclosed. More specifically, the adhesive compositions comprise at least one polymerizable acrylate monomer system; an effective amount for initiation of a free radical initiator; and elemental (atomized) aluminum metal powder or powdered alumina.

Abstract: Rapid cure polymerizable monomer sealing and bonding compositions are disclosed. The polymerizable compositions comprise at least one polymerizable acrylate monomer system comprising a urethane acrylate monomer having vinyl reactive ends, and at least one hydroxy-terminated, monofunctional, short chain monomer which is soluble in or miscible with the urethane acrylate monomer; an effective amount for initiation of a free radical initiator; and a compatible filler material.

Abstract: Disclosed are cure-to-elastomer compositions comprising: (A) a moderate-to-long chain di or polyfunctional prepolymer having vinyl reactive ends, (B) a cross-link controlling material which is (i) reactive with said moderate-to-long chain di or polyfunctional prepolymer, and (ii) soluble in or miscible with the moderate-to-long chain prepolymer; and (C) a free radical polymerization initiator. The polymerizable compositions of the present invention can be rapidly cured at room or moderate temperature to produce elastomeric materials of high flexibility and appropriate tensile strength.

Abstract: A curable system such as a curable adhesive type system having a relatively long pot life is disclosed. The curable system of the present invention comprises polymer containing material including at least one curable epoxy resin, at least one imidazole type catalytic curing agent for the resin and a solvent for the epoxy resin capable of suppressing or inhibiting the catalytic reaction between the resin and curing agent at least at about room temperature, the solvent being selected from methanol, ethanol and mixtures thereof.