Patents by Inventor James P. Paoletti

James P. Paoletti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuitized substrate and method of making same
    Publication number: 20090241332
    Abstract: A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Inventors: John M. Lauffer, Roy H. Magnuson, Voya R. Markovich, James P. Paoletti, Kostas I. Papathomas, Rajinder S. Rai
  • Printed wiring board structure with z-axis interconnections
    Patent number: 6593534
    Abstract: A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 15, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gerald W. Jones, John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti, Konstantinos I. Papathomas, James R. Stack