Patents by Inventor James P. Roland

James P. Roland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8102044
    Abstract: A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: January 24, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Richard C. Ruby, James P. Roland, Frank S. Geefay
  • Publication number: 20100096745
    Abstract: A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 22, 2010
    Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Richard Ruby, James P. Roland, Frank S. Geefay
  • Patent number: 6794218
    Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: September 21, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Eric J. Barton, David S. Pitou, Patricia E. Johnson, Mohammad A. Safai, James P. Roland
  • Patent number: 6744109
    Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: June 1, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Eric J. Barton, David S. Pitou, Patricia E. Johnson, Mohammad A. Safai, James P. Roland
  • Publication number: 20040036069
    Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.
    Type: Application
    Filed: August 4, 2003
    Publication date: February 26, 2004
    Inventors: Eric J. Barton, David S. Pitou, Patricia E. Johnson, Mohammad A. Safai, James P. Roland
  • Publication number: 20040002179
    Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.
    Type: Application
    Filed: June 26, 2002
    Publication date: January 1, 2004
    Inventors: Eric J. Barton, David S. Pitou, Patricia E. Johnson, Mohammad A. Safai, James P. Roland
  • Patent number: 4514252
    Abstract: A technique is presented for producing tapered walls. In accordance with the disclosed technique, a mask is generated on a workpiece and the workpiece is etched through the mask to replicate the mask pattern into the mask. These steps result in walls at the boundaries of the replicated mask features. In many such processes, these walls are either substantially vertical or have an overhanging portion of the walls. In order to taper the walls, the upper corners of the walls are cut away to remove the overhang or to cut the corner back an additional amount to produce a controlled amount of taper.
    Type: Grant
    Filed: November 18, 1982
    Date of Patent: April 30, 1985
    Assignee: Hewlett-Packard Company
    Inventor: James P. Roland