Abstract: Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

Abstract: Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Abstract: We provide a novel cleanroom-based process flow that allows for easy creation of multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200 - 300 and transferred to the substrate underneath via a single shot deep etching step. This method is also easily characterizable - using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures.

Abstract: Apparatuses for removal of solids from water comprising a heater for heating an immiscible liquid (IL), a humidifier having porous sheets allowing direct contact between the IL and water, thereby separating the solids by evaporating the water into cool dry air flowing past the porous sheets, and a dehumidifier comprising porous sheets that allow direct contact between the cool IL and hot moist air flowing past the porous sheets, thereby condensing fresh water from the moist air. Also disclosed are methods for removal of solids from water by heating an IL, distributing the IL to porous sheets in a humidifier, distributing water with dissolved solids to the porous sheets, separating the solids from the water by evaporating the water into dry air flowing past the porous sheets, and condensing fresh water by flowing the moist air past porous sheets in a dehumidifier having cool IL distributed to the porous sheets.

Abstract: Apparatuses for removal of solids from water comprising a heater for heating an immiscible liquid (IL), a humidifier having porous sheets allowing direct contact between the IL and water, thereby separating the solids by evaporating the water into cool dry air flowing past the porous sheets, and a dehumidifier comprising porous sheets that allow direct contact between the cool IL and hot moist air flowing past the porous sheets, thereby condensing fresh water from the moist air. Also disclosed are methods for removal of solids from water by heating an IL, distributing the IL to porous sheets in a humidifier, distributing water with dissolved solids to the porous sheets, separating the solids from the water by evaporating the water into dry air flowing past the porous sheets, and condensing fresh water by flowing the moist air past porous sheets in a dehumidifier having cool IL distributed to the porous sheets.

Abstract: Improved charging performance for electrochemical devices such as batteries and supercapacitors is provided. A porous electrode is configured to have a lower electrode conductivity than the ion conductivity of the electrolyte disposed in pores of the electrode, in part or all of the electrode. This reduced electrode conductivity can be tailored to reduce ion depletion in the electrolyte. Modeling results show that the reduced ion depletion leads to decreased charging time. Further results show a negligible increase in total electrical loss, because increased loss in the electrode is compensated by reduced loss in the electrolyte. This approach is in sharp contrast to the conventional approach of simply maximizing electrode conductivity.