Patents by Inventor James Patrick Doyle
James Patrick Doyle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8241957Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: October 18, 2010Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 8081280Abstract: In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed.Type: GrantFiled: April 30, 2007Date of Patent: December 20, 2011Assignee: International Business Machines CorporationInventors: George Liang-Tai Chiu, Steven Alan Cordes, James Patrick Doyle, Matthew J. Farinelli, Minhua Lu, Hiroki Nakano, Ronald Nunes, James Vichiconti
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Publication number: 20110034047Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Applicant: International Business Machines CorporationInventors: Gareth Geoffrey HOUGHAM, S. Jay CHEY, James Patrick DOYLE, Xiao Hu LIU, Christopher V. JAHNES, Paul Alfred LAURO, Nancy C. LaBIANCA, Michael J. ROOKS
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Patent number: 7883919Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: July 6, 2009Date of Patent: February 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Publication number: 20090316096Abstract: The present invention includes a method of preparing a dry deposited liquid-crystal alignment layer using one of a mechanical mask, photo-resist, UV treatment, and ridge and fringe field methods. The present invention further provides a multi-domain, wide viewing angle liquid-crystal display, comprising: a bottom substrate; a first transparent conductive layer; a top substrate; a color filter layer; a second transparent conductive layer; a first dry deposited liquid-crystal alignment layer; a second dry deposited liquid-crystal alignment layer, the second dry deposited liquid-crystal alignment layer being spaced adjacent to and facing the first dry deposited liquid-crystal alignment layer; spacers; and a liquid-crystal material.Type: ApplicationFiled: August 27, 2009Publication date: December 24, 2009Inventors: Alessandro Cesare Callegari, Praveen Chaudhari, James Patrick Doyle, Eileen Galligan, James Andrew Lacey, Shui-Chih Alan Lien
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Publication number: 20090263991Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: ApplicationFiled: July 6, 2009Publication date: October 22, 2009Inventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 7579069Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.Type: GrantFiled: November 6, 2003Date of Patent: August 25, 2009Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Xiao Hu Liu, S. Jay Chey, James Patrick Doyle, Joseph Zinter, Jr., Michael J. Rooks, Brian Richard Sundlof, Jon Alfred Casey
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Patent number: 7556979Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: GrantFiled: October 31, 2007Date of Patent: July 7, 2009Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 7417315Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: GrantFiled: December 5, 2002Date of Patent: August 26, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 6866415Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: GrantFiled: January 21, 2003Date of Patent: March 15, 2005Assignee: International Business Machines CorporationInventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Patent number: 6817761Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: GrantFiled: April 21, 2003Date of Patent: November 16, 2004Assignee: International Business Machines CorporationInventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Publication number: 20040151911Abstract: An apparatus for depositing and aligning an amorphous film in a single step, a method of forming an aligned film on a substrate in a single step by combining the deposition and alignment of an alignment layer into a single-step using ion beam processing and an amorphous film having an aligned atomic structure prepared by a method in which an aligned film is deposited and aligned in a single step are provided. The film is deposited and aligned in a single step by bombarding a substrate with an ion beam at a designated incident angle to simultaneously (a) deposit the film onto the substrate and (b) arrange an atomic structure of the film in at least one predetermined aligned direction.Type: ApplicationFiled: September 11, 2003Publication date: August 5, 2004Inventors: Alessandro Cesare Callegari, Praveen Chaudhari, James Patrick Doyle, Eileen Ann Galligan, Yoshimine Kato, James Andrew Lacey, Shui-Chih Alan Lien, Minhua Lu, Hiroki Nakano, Shuichi Odahara
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Publication number: 20040110322Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.Type: ApplicationFiled: December 5, 2002Publication date: June 10, 2004Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 6724449Abstract: A liquid crystal display device includes a first substrate, a dry alignment film deposited over the substrate, a second substrate coupled to the first substrate with the dry alignment film deposited over the second substrate therebetween and forming a cell gap, and a liquid crystal material formed in the cell gap. The dry alignment film allows for a truly vertical alignment of molecules of the liquid crystal material such that the molecules form an angle of substantially 90° relative to the substrate. The dry alignment film can be an oxide layer, a nitride layer, an oxynitride layer or a silicon layer. This dry alignment layer can be treated to form a tilted homeotropic alignment, such that the liquid crystal molecules have a pretilt angle of 0.5 to 10 degrees from a substrate normal direction.Type: GrantFiled: March 27, 2000Date of Patent: April 20, 2004Assignee: International Business Machines CorporationInventors: Paul Stephen Andry, Chen Cai, Kevin Kok Chan, Praveen Chaudhari, James Patrick Doyle, Eileen Ann Galligan, Richard Allen John, James Andrew Lacey, Shui-Chih Alan Lien
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Publication number: 20040028117Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: ApplicationFiled: April 21, 2003Publication date: February 12, 2004Inventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Patent number: 6679625Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: GrantFiled: December 17, 2001Date of Patent: January 20, 2004Assignee: International Business Machines CorporationInventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Patent number: 6652139Abstract: A method of fabricating a scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. The invention also relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: GrantFiled: January 21, 2003Date of Patent: November 25, 2003Assignee: International Business Machines CorporationInventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Patent number: 6632483Abstract: The present invention includes a method of forming an aligned film on a substrate. The film is deposited and aligned in a single step by a method comprising the step of bombarding a substrate with an ion beam at a designated incident angle to simultaneously (a) deposit the film onto the substrate and (b) arrange an atomic structure of the film in at least one predetermined aligned direction.Type: GrantFiled: June 30, 2000Date of Patent: October 14, 2003Assignee: International Business Machines CorporationInventors: Alessandro Cesare Callegari, Praveen Chaudhari, James Patrick Doyle, Eileen Ann Galligan, Yoshimine Kato, James Andrew Lacey, Shui-Chih Alan Lien, Minhua Lu, Hiroki Nakano, Shuichi Odahara
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Publication number: 20030169798Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.Type: ApplicationFiled: January 21, 2003Publication date: September 11, 2003Inventors: Steven Alan Cordes, David R. DiMilia, James Patrick Doyle, Matthew James Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal, Chandler Todd McDowell, Li Shi
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Patent number: 6613602Abstract: A method and system for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a substrate having a plurality of pointed tips covered by a metallic layer is formed. Portions of the metallic layer are covered by an insulator and other portions of the metallic layer are exposed. Next, a patterned layer of thermoelectric material is formed by depositions extending from the exposed portions of the metallic layer in the presence of a deposition mask. Finally, a metallic layer is formed to selectively contact the patterned layer of thermoelectric material.Type: GrantFiled: December 13, 2001Date of Patent: September 2, 2003Assignee: International Business Machines CorporationInventors: Emanuel Israel Cooper, Steven Alan Cordes, David R. DiMilia, Bruce Bennett Doris, James Patrick Doyle, Uttam Shyamalindu Ghoshal, Robin Altman Wanner