Abstract: A chip package comprises a substrate with a composite capacitor/stiffener on the substrate. In one embodiment of the present invention, the substrate comprises a plurality of dielectric layers and a plurality of metallic layers interlaced with the dielectric layers. One of the metallic layers is on a surface of the substrate. Another dielectric layer is adhered onto the one metallic layer. A metallic plate is adhered onto the other dielectric layer, opposite the one metallic layer. The metallic plate is electrically connected to power or ground. The one metallic layer is electrically connected to ground or power, respectively, such that the metallic plate, the other dielectric layer and the one metallic layer form a capacitor. The one metallic layer is joined to a respective one of the plurality of dielectric layers in a same manner as another of the plurality of metallic layers is joined to another, respective one of the plurality of dielectric layers.

Abstract: A chip package comprises a substrate with a composite capacitor/stiffener on the substrate. In one embodiment of the present invention, the substrate comprises a plurality of dielectric layers and a plurality of metallic layers interlaced with the dielectric layers. One of the metallic layers is on a surface of the substrate. Another dielectric layer is adhered onto the one metallic layer. A metallic plate is adhered onto the other dielectric layer, opposite the one metallic layer. The metallic plate is electrically connected to power or ground. The one metallic layer is electrically connected to ground or power, respectively, such that the metallic plate, the other dielectric layer and the one metallic layer form a capacitor. The one metallic layer is joined to a respective one of the plurality of dielectric layers in a same manner as another of the plurality of metallic layers is joined to another, respective one of the plurality of dielectric layers.