Abstract: A method of additively manufacturing a plurality of parts in a manner that facilitates efficient collection of metrology data on the parts is described herein. The method includes the steps of: additively manufacturing a construct, the construct comprising: (i) a backing, and (ii) a plurality of parts connected to the backing; inserting the backing into an imaging apparatus in an orientation in which the plurality of parts are positioned for imaging; then imaging the plurality parts in the imaging apparatus to collect image data from each part, and then removing the construct from the imaging apparatus and separating the parts from the backing.

Abstract: A method of additively manufacturing a plurality of parts in a manner that facilitates efficient collection of metrology data on the parts is described herein. The method includes the steps of: additively manufacturing a construct, the construct comprising: (i) a backing, and (ii) a plurality of parts connected to the backing; inserting the backing into an imaging apparatus in an orientation in which the plurality of parts are positioned for imaging; then imaging the plurality parts in the imaging apparatus to collect image data from each part, and then removing the construct from the imaging apparatus and separating the parts from the backing.

Abstract: A method of packaging an integrated circuit includes (a) providing: (i) an integrated circuit (e.g., in wafer form) having a two-dimensional contact array on a top surface thereof, (ii) a polymer shell lower portion, and (iii) a polymer shell upper portion, said upper portion having a two-dimensional array of openings formed therein, which array of openings corresponds to said two dimensional contact array; wherein one or both of said polymer shell upper and lower portions are produced by the process of additive manufacturing; and (b) enclosing said integrated circuit between said polymer shell lower portion and said polymer shell upper portion with said contact array aligned with array of openings to produce a integrated circuit packaged within a polymer shell.

Abstract: A method of encapsulating at least one object in a polymer shell includes (a) providing a carrier having a release surface and at least one object releasably secured thereto, each object having a heighth dimension and a width dimension; (b) providing a light polymerizable resin, the resin supported on a light transmissive window; (c) advancing each object on the carrier into the light polymerizable resin to a position spaced away from the window by a distance sufficient to maintain a dead zone or release layer of unpolymerized resin directly on the window; (d) forming a first portion of the polymer shell around each object by projecting patterned light through the window; (e) forming a subsequent portion of a polymer shell on or around each object by advancing the object on the carrier away from the window and projecting patterned light through the window; and (f) repeating step (e) until each object is encapsulated in a polymer shell.