Patents by Inventor James Paul Smith
James Paul Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11594470Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: GrantFiled: April 26, 2021Date of Patent: February 28, 2023Assignee: Massachesetts Institute of TechnologyInventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
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Patent number: 11482120Abstract: A device includes a processor. The processor is configured to execute instructions to receive first operator input and generate layers for a map based on the first operator input. The layers include features to indicate whether an Uncrewed Aerial Vehicle (UAV) operator should or could fly a UAV in an airspace corresponding to an area within the map. The processor is also configured to receive second operator input that specifies a path on the map, for a UAV flight.Type: GrantFiled: July 15, 2020Date of Patent: October 25, 2022Assignee: Verizon Patent and Licensing Inc.Inventors: Jonathan R. Natiuk, Amie Kuttruff, Alexei P. Yagolnikov, Tariq M. Rashid, John William Fahey, Gregory Bauwens, Leah Brady, James Paul Smith, Shane Williams
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Patent number: 11322426Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: GrantFiled: December 21, 2020Date of Patent: May 3, 2022Assignee: Massachusetts Institute of TechnologyInventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
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Publication number: 20220020276Abstract: A device includes a processor. The processor is configured to execute instructions to receive first operator input and generate layers for a map based on the first operator input. The layers include features to indicate whether an Uncrewed Aerial Vehicle (UAV) operator should or could fly a UAV in an airspace corresponding to an area within the map. The processor is also configured to receive second operator input that specifies a path on the map, for a UAV flight.Type: ApplicationFiled: July 15, 2020Publication date: January 20, 2022Inventors: Jonathan R. Natiuk, Amie Kuttruff, Alexei P. Yagolnikov, Tariq M. Rashid, John William Fahey, Gregory Bauwens, Leah Brady, James Paul Smith, Shane Williams
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Publication number: 20210265240Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: ApplicationFiled: April 26, 2021Publication date: August 26, 2021Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
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Patent number: 11018077Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: GrantFiled: April 9, 2020Date of Patent: May 25, 2021Assignee: Massachusetts Institute of TechnologyInventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
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Publication number: 20210134703Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: ApplicationFiled: December 21, 2020Publication date: May 6, 2021Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne
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Patent number: 10903141Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: GrantFiled: December 12, 2019Date of Patent: January 26, 2021Assignee: Massachusetts Institute of TechnologyInventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
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Publication number: 20200312746Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: ApplicationFiled: April 9, 2020Publication date: October 1, 2020Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
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Publication number: 20200168526Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: ApplicationFiled: December 12, 2019Publication date: May 28, 2020Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne
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Patent number: 10665529Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: GrantFiled: July 19, 2018Date of Patent: May 26, 2020Assignee: Massachusetts Institute of TechnologyInventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
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Patent number: 10651112Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: GrantFiled: October 30, 2017Date of Patent: May 12, 2020Assignee: Massachusetts Institute of TechnologyInventors: Bernard A. Malouin, Jr., James Paul Smith, Eric A. Browne
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Publication number: 20200027819Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.Type: ApplicationFiled: July 19, 2018Publication date: January 23, 2020Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne
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Patent number: 10512152Abstract: The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.Type: GrantFiled: July 17, 2018Date of Patent: December 17, 2019Assignee: Massachusetts Institute of TechnologyInventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne, Kenneth L. Smith
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Publication number: 20190029105Abstract: The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.Type: ApplicationFiled: July 17, 2018Publication date: January 24, 2019Inventors: James Paul Smith, Bernard A. Malouin, JR., Eric A. Browne, Kenneth L. Smith
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Publication number: 20190013258Abstract: The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.Type: ApplicationFiled: October 30, 2017Publication date: January 10, 2019Inventors: Bernard A. Malouin, JR., James Paul Smith, Eric A. Browne