Patents by Inventor James Pelrin
James Pelrin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10060668Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: GrantFiled: April 1, 2013Date of Patent: August 28, 2018Assignee: Temptronic CorporationInventors: Kenneth M. Cole, Sr., Michael F. Conroy, Edward Lowerre, James Pelrin
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Publication number: 20140064323Abstract: An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.Type: ApplicationFiled: November 4, 2013Publication date: March 6, 2014Applicant: TEMPTRONIC CORPORATIONInventors: James Pelrin, Norbert W. Elsdoerfer
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Patent number: 8602641Abstract: An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.Type: GrantFiled: October 26, 2011Date of Patent: December 10, 2013Assignee: Temptronic CorporationInventors: James Pelrin, Norbert W. Elsdoerfer
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Publication number: 20130231040Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: ApplicationFiled: April 1, 2013Publication date: September 5, 2013Applicant: Temptronics CorporationInventors: Kenneth M. Cole, SR., Michael F. Conroy, Edward Lowerre, James Pelrin
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Publication number: 20130107906Abstract: An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.Type: ApplicationFiled: October 26, 2011Publication date: May 2, 2013Applicant: Temptronic CorporationInventors: James PELRIN, Norbert W. Elsdoerfer
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Patent number: 8408020Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: GrantFiled: November 4, 2009Date of Patent: April 2, 2013Assignee: Temptronic CorporationInventors: Kenneth M. Cole, Sr., Michael F. Conroy, Edward Lowerre, James Pelrin
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Publication number: 20100043485Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: ApplicationFiled: November 4, 2009Publication date: February 25, 2010Applicant: TEMPTRONIC CORPORATIONInventors: Kenneth M. Cole, SR., Michael F. Conroy, Edward Lowerre, James Pelrin
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Patent number: 7629533Abstract: A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: GrantFiled: March 13, 2007Date of Patent: December 8, 2009Assignee: Temptronic CorporationInventors: Kenneth M. Cole, Sr., Michael F. Conroy, Edward Lowerre, James Pelrin
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Publication number: 20070240448Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.Type: ApplicationFiled: March 13, 2007Publication date: October 18, 2007Applicant: Temptronic CorporationInventors: Kenneth Cole, Michael Conroy, Edward Lowerre, James Pelrin
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Publication number: 20050121186Abstract: A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow rate technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate.Type: ApplicationFiled: November 23, 2004Publication date: June 9, 2005Inventors: Douglas Hudson, James Pelrin, Sanjiv Patel, Chin Chien Tee, Kenneth Cole
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Patent number: 6886347Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.Type: GrantFiled: July 10, 2003Date of Patent: May 3, 2005Assignee: Temptronic CorporationInventors: Douglas E. Hudson, Dana G. Butcher, Richard B. Gates, James Pelrin
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Publication number: 20040107704Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.Type: ApplicationFiled: July 10, 2003Publication date: June 10, 2004Inventors: Douglas E. Hudson, Dana G. Butcher, Richard B. Gates, James Pelrin