Patents by Inventor James Pollacek

James Pollacek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method for bumpless beam lead tape
    Patent number: 4917286
    Abstract: A tape automated bonding method and structure is disclosed. Interconnection using prepatterned metal beam tape interconnect is accomplished by providing vias in passivation layers overlaying a metal region in or on the major surface of the device which is to receive the interconnect leads, eliminating the requirement for bonding pad bumps. Ultrasonic pressure is applied to the beams as they superpose the vias, bonding each lead to its respective metal region.
    Type: Grant
    Filed: December 1, 1988
    Date of Patent: April 17, 1990
    Assignee: Hewlett-Packard Company
    Inventor: James Pollacek