Abstract: A computer-implemented method for determining which portions of a roadway model used by self-driving road vehicles require updating uses discrepancy data derived from the sensors of a plurality of self-driving road vehicles. The discrepancy data may indicate discrepancies between the sensor data and the roadway model, or may indicate portions of the roadway where a self-driving road vehicle underperformed. The discrepancy data is aggregated, and the aggregated discrepancy data is used to identify, as the portions of the roadway model which require updating, those portions of the roadway model corresponding to portions of the roadway for which the aggregated discrepancy data exceeds a threshold.

Abstract: Image data obtained from an image sampling of a physical surface is integrated with position data obtained from a three-dimensional surface sampling of the same physical surface by combining data from the images with the measured surface points from the surface sampling to create additional “implied” surface points between the measured surface points. Thus, the originally obtained point cloud of measured surface points is densified by adding the implied surface points. Moreover, the image data can be used to apply colors to both the implied data points and the measured data points, resulting in a colored three-dimensional representation of the physical surface that is of higher resolution than a representation obtained from only the measured surface points.

Abstract: Image data obtained from an image sampling of a physical surface is integrated with position data obtained from a three-dimensional surface sampling of the same physical surface by combining data from the images with the measured surface points from the surface sampling to create additional “implied” surface points between the measured surface points. Thus, the originally obtained point cloud of measured surface points is densified by adding the implied surface points. Moreover, the image data can be used to apply colors to both the implied data points and the measured data points, resulting in a colored three-dimensional representation of the physical surface that is of higher resolution than a representation obtained from only the measured surface points.

Abstract: Image data obtained from an image sampling of a physical surface is integrated with position data obtained from a three-dimensional surface sampling of the same physical surface by combining data from the images with the measured surface points from the surface sampling to create additional “implied” surface points between the measured surface points. Thus, the originally obtained point cloud of measured surface points is densified by adding the implied surface points. Moreover, the image data can be used to apply colors to both the implied data points and the measured data points, resulting in a colored three-dimensional representation of the physical surface that is of higher resolution than a representation obtained from only the measured surface points.

Abstract: Image data obtained from an image sampling of a physical surface is integrated with position data obtained from a three-dimensional surface sampling of the same physical surface by combining data from the images with the measured surface points from the surface sampling to create additional “implied” surface points between the measured surface points. Thus, the originally obtained point cloud of measured surface points is densified by adding the implied surface points. Moreover, the image data can be used to apply colors to both the implied data points and the measured data points, resulting in a colored three-dimensional representation of the physical surface that is of higher resolution than a representation obtained from only the measured surface points.

Abstract: An assembly for positioning a retaining ring includes a mandrel having an outer diameter smaller than an outer diameter of a rotor. The assembly also includes a seal assembly for sealing a circumferential retaining ring around the mandrel or the rotor, the seal assembly comprising a pair of seal plates situated around opposing ends of the retaining ring. Further, the assembly includes a hydraulic expansion device for providing a fluid pressure for hydraulically expanding the retaining ring until an inner diameter of the retaining ring is greater than the outer diameter of the rotor. Furthermore, the assembly includes a displacement device for providing axial movement of the seal assembly and the retaining ring.

Abstract: An assembly for positioning a retaining ring includes a mandrel having an outer diameter smaller than an outer diameter of a rotor. The assembly also includes a seal assembly for sealing a circumferential retaining ring around the mandrel or the rotor, the seal assembly comprising a pair of seal plates situated around opposing ends of the retaining ring. Further, the assembly includes a hydraulic expansion device for providing a fluid pressure for hydraulically expanding the retaining ring until an inner diameter of the retaining ring is greater than the outer diameter of the rotor. Furthermore, the assembly includes a displacement device for providing axial movement of the seal assembly and the retaining ring.

Abstract: A riser apparatus and method according to which an anchor is installed on the sea bed and a riser conduit is pivotally mounted on the anchor. The riser conduit is provided with end connectors for connection to an upper riser section leading, respectively, to a production platform and a lower riser section leading to a wellhead or subsea storage or export facility. The riser conduit is preformed into a predetermined curved shape and is provided with stiffening webs to safeguard its rigidity, so that it substantially retains its predetermined shape when movements are transmitted through the riser conduit from the upper riser section to the lower riser section, or conversely.

Abstract: The error offset and the error magnitude of a data stream in a Read-Solomon code is calculated using the same architecture. The advantage this method has over previous techniques is its simplicity of design and the minimum steps required to convert the syndrome information into an error location and correction pattern. The maximum of four cycles (steps) needed to compute the offset and correction pattern allows for a correction to be applied in the byte time immediately following receipt of the last check byte.

Abstract: The present invention relates generally to an oxidation and corrosion resistant coating composition produced by a vapor phase co-deposition of transition metals on metallic components. In particular, this coating includes aluminum and silicon and the coated substrate may comprise precious metal, nickel, cobalt or MCrALY. Such coatings are particularly useful in protecting nickel and cobalt and iron-based superalloys from heat corrosion and oxidation attack, especially during high temperature operation, e.g., gas turbine and jet engine hot zones.

Abstract: The present invention relates generally to an oxidation and corrosion resistant coating composition produced by a vapor phase co-deposition of transition metals on metallic components. In particular, this coating includes aluminum and silicon and the coated substrate may comprise precious metal, nickel, cobalt or MCrALY. Such coatings are particularly useful in protecting nickel and cobalt and iron-based superalloys from heat corrosion and oxidation attack, especially during high temperature operation, e.g., gas turbine and jet engine hot zones.

Abstract: Segmentation or singulation of an encapsulated, spaced-apart array of semiconductor devices into a plurality of discrete device packages is facilitated by forming a pattern of indentations in the upper, exposed surface of the encapsulant material in a pattern corresponding to and in vertical registry with the pattern of spaces between adjacent devices of the array. Segmentation of the array is performed by cutting along the indentations. Advantages provided by cutting along the indentations include a shortened time interval for the cutting (e.g., by sawing), reduced tendency for warping due to stresses present in the encapsulant material as a result of curing, and improved physical appearance of discrete device packages due to the chamfered edges resulting in reduced edge chipping during sawing.

Abstract: Warpage-free post-mold curing (PMC) of encapsulated device arrays, e.g., TSOPs, is performed without requiring placement of heavy metal weights on the arrays by utilization of molding/encapsulant materials having reduced coefficients of thermal expansion (CTE) and increased flexural moduli at both high and low temperature. Good lead co-planarity is maintained subsequent to PMC as a result of better matching of the encapsulant/molding material properties with those of the IC chip, lead frame, and substrate (e.g., Cu or Cu-based).