Abstract: An electronic device is made by a method of connecting a circuit member to a substrate. The circuit member is of the type having a discontinuous passivating layer thereon with recesses therein establishing electrical contacts. The circuit member is connected to a mounting surface of a substrate having conductive paths. An adhesive including a resin with spaced conductive metal particles suspended therein is applied over the conductive paths. The distance between the electrical contacts and conductive paths is decreased to provide electrical conduction through the adhesive, while maintaining the adhesive between conductive paths non-conductive. The conductive paths may have established thereon raised or protruding contact surfaces over a portion thereof. The circuit member is mounted on the adhesive while vertically aligning the electrical contacts over pre-selected protruding contact surfaces.

Abstract: An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16).

Abstract: An electronic device made by the method of connecting a circuit member (18) having a plurality of laterally spaced electrically conductive terminals (20) to a substrate (12) including a mounting surface (14) having a plurality of laterally spaced conductive paths (16) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) having the conductive paths (16) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning the conductive terminals (20) over preselected ones of the conductive paths (16).

Abstract: An electronic device made by the method of connecting a circuit member (18) to a substrate (12) wherein the method includes the steps of applying an adhesive (22) including a resin having a twenty to twenty-five percent by weight content of conductive metal particles over the mounting surface (14) of the substrate (12) wherein the resin is a dielectric preventing conductivity between the spaced metal particles therein and mounting the circuit member (18) on the adhesive (22) while vertically aligning conductive terminals (20) of the circuit member (18) over preselected ones of conductive paths (16) of the substrate (12).