Abstract: A socket connector suitable for use in establishing interconnection to a plurality of closely spaced surface pad portions of traces on a circuit panel is disclosed. This socket connector is suitable for use with a high density single in-line memory module. The individual terminals are edge stamped from a spring metal blank and inserted in closely spaced centerlines and cavities in the housing. Insertion of a circuit panel edgewise into the connector biases the terminals outwardly with the stresses primarily confined to the plane of the spring metal blank. The terminals are inserted from above and positively retained within the housing. Low insertion forces, together with a wiping action between the terminals and the surface pad portions of traces on the circuit panel is achieved.

Abstract: Terminals for a socket connector suitable for use in establishing interconnection to a plurality of closely spaced surface pad portions of traces on a circuit panel are disclosed. This socket connector is suitable for use with a high density single in-line memory module. The individual terminals are edge stamped from a spring metal blank and inserted in closely spaced centerlines and cavities in the housing. Insertion of a circuit panel edgewise into the connector biases the terminals outwardly with the stresses primarily confined to the plane of the spring metal blank. The terminals are inserted from above and positively retained within the housing. Low insertion forces, together with a wiping action between the terminals and the surface pad portions of traces on the circuit panel is achieved.

Abstract: Sockets specifically adapted for burn-in testing of small outline integrated circuit components are disclosed. The multicontact sockets have terminals located in cavities oriented to receive the small outline integrated circuit leads. The terminals are located between adjacent leads and are positioned to resiliently engage the interstitial edges of the package leads, thus imparting minimal stress normal to the plane of the leads. Both surface mount and through-hole sockets are disclosed and the terminals as depicted can have a bowed leaf spring configuration or a preloaded flat terminal, arcuately deformed for retention within the housing cavities. Thus the small outline integrated circuit components can be routinely inserted into the sockets for test purposes. The sockets can also be used in a conventional manner to socket integrated circuit components such as SOICs on a printed circuit board.

Abstract: A socket for stacking and interconnecting corresponding leads of two integrated circuit packages having the contacts stamped and formed in a lead frame configuration with a dielectric body molded over a portion of the terminal ends. Two contact halves are sheared from the opposite end of the terminal, one contact formed upwardly while the second contact is formed downwardly. Integrated circuit package leads can be selectively commoned by jumpering the terminal ends prior to molding the body.

Abstract: An electrical connector includes a stamped and formed terminal for establishing electrical contact with a terminal post having a rectilinear cross section. The terminal has at least one resilient beam which has a contact area having an arcuate cross section. The concave surface of the arcuate cross section engages the edge of the terminal posts to provide a good electrical connection even if excess solder is deposited on the exterior of the terminal post in the vicinity of the contact region.

Abstract: DIP carrier assembly comprises carrier having support surface with apertures therethrough to channels in side and bottom of carrier into which DIP leads are formed. Terminals aligned in channels in opposed sidewalls of socket apply releasing force on carrier when DIP leads deflect contact portions of terminals. Release of resilient latch on socket causes ejection of carrier.

Abstract: Socket for a surface mount DIP comprises a housing having two rows of elongate contacts in respective apertures extending between package receiving face and opposed mounting face. Apertures intersect channels in sidewalls of nest in package receiving face forming channels which receive feet extending laterally of package. Contacts are formed with leaf springs which engage feet in channels.

Abstract: Socket for receiving edge of a chip carrier substrate comprises a dielectric housing having an elongate channel interrupted by partitions having aligned U-slots which limit position of substrate. Cavities separated by the partitions receive U-shaped contacts each having a base with directly opposed arms formed upward therefrom and a flat pin formed downward therefrom and extending into respective apertures in the floor of the channel. Arms present convex rolled inside surfaces to opposed surfaces of substrate for electrical contact therewith. Floor of channel has convex portion in each cavity on which base rocks as pin deflects resiliently in chamfered lead-in to aperture to accommodate any substrate warpage. Profile of U-slot in partition prevents stressing of arms beyond elastic limit.

Abstract: Electrical connector comprising housing with two rows of cavities having latch arms which retain terminals received therein and wedge means received in interstices between latch arms of adjacent rows. Wedge means cannot be fully received in interstices unless terminals are fully seated in cavities.

Abstract: The present invention relates to a device for securing stacked printed circuit boards together utilizing signal transferring connectors mounted on the boards. More particularly, the device includes depending pins having grooves thereon and movable latching means on the connector, said means engaging the grooves to releasably latch the board and connector together.

Abstract: A contact for use in printed circuit boards in which a portion thereof is split or sheared to form at least a pair of legs for insertion into an aperture in said circuit board with the adjacent legs each having a surface which face and abut each other in the shear plane therebetween and with said legs being offset with respect to each other in said shear plane. When the offset legs are inserted in an aperture in a circuit board they are forced towards each other along the shear plane with the facing surfaces experiencing a strong component of force normal to said shear plane. Such normal force in turn produces a large frictional force between said facing surfaces which, together with the spring-like force generated as the legs are forced together, produce a strong opposing force against the walls of the aperture.