Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the conductor pattern and the substrate.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the IDT and the substrate.

Abstract: A stacked die XBAR filter device includes a first die containing one or more XBARs on a first surface, a second die containing one or more XBARs on a second surface, and one or more conductive vias through either the first die or the second die, where the first die is connected to the second die with the first surface facing the second surface.

Abstract: Acoustic resonators, filters and methods of making resonators are disclosed. An acoustic resonator includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between a surface of the substrate and a back surface of the piezoelectric plate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second busbars and a plurality of interleaved fingers extending alternately from the first and second busbars. At least a portion of the first busbar contacts the substrate through an opening in the piezoelectric plate and acoustic Bragg reflector.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on a diaphragm of the plate that is formed over a cavity in the substrate. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the substrate to provide lower thermal resistance between the IDT and the substrate.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the IDT and the substrate.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the device to provide lower thermal resistance between the conductor pattern and the substrate.

Abstract: Acoustic filters, resonators and methods are disclosed. An acoustic filter device includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer is formed on the front surface of the piezoelectric plate with interleaved fingers of the IDT disposed on the diaphragm. At least a portion of a perimeter of the cavity is curved and at least one end zone of the perimeter of the cavity is round.

Abstract: Methods to design band-pass acoustic wave microwave filters are disclosed. A performance metric related to an input impedance of a baseline filter design is calculated, the baseline filter design including a plurality of series surface acoustic wave resonators and a plurality of shunt surface acoustic wave resonators, each surface acoustic wave resonator having a respective resonant frequency. One or more alternative filter designs is established, each alternative filter design derived from the baseline filter design by reordering the resonant frequencies of two or more of the plurality of series surface acoustic wave resonators and/or two or more of the plurality of shunt surface acoustic wave resonators. A respective performance metric related to an input impedance of each alternative filter designs is calculated. A final filter design is selected from among the baseline filter design and the alternative filter designs based on the respective performance metrics.

Abstract: A transmit filter for a communications device includes a surface acoustic wave (SAW) band-pass filter configured to pass a transmit frequency band and a tunable transmitter impedance matching network in series. The tunable transmitter impedance matching network matches an input impedance of the SAW band-pass filter to the output impedance of a power amplifier over a portion of the transmit frequency band in response to a tuning input.

Abstract: Methods to design band-pass acoustic wave microwave filters are disclosed. A performance metric related to an input impedance of a baseline filter design is calculated, the baseline filter design including a plurality of series surface acoustic wave resonators and a plurality of shunt surface acoustic wave resonators, each surface acoustic wave resonator having a respective resonant frequency. One or more alternative filter designs is established, each alternative filter design derived from the baseline filter design by reordering the resonant frequencies of two or more of the plurality of series surface acoustic wave resonators and/or two or more of the plurality of shunt surface acoustic wave resonators. A respective performance metric related to an input impedance of each alternative filter designs is calculated. A final filter design is selected from among the baseline filter design and the alternative filter designs based on the respective performance metrics.

Abstract: Methods of designing band-pass filters are disclosed. A baseline filter design is established, the baseline filter design including a plurality of surface acoustic wave resonators having respective resonant frequencies, the surface acoustic wave resonators organized by resonant frequency into two or more groups. One or more alternative filter designs are established, each alternative filter design derived from the baseline filter design by reordering the resonant frequencies of two or more surface acoustic wave resonators within at least one of the two or more groups. A respective performance metric related to input impedance over a pass band is calculated for each of the baseline filter design and the alternative filter designs. A final filter design is selected from the baseline filter design and the alternative filter designs based on the respective performance metrics.

Abstract: A transmit filter for a communications device includes a surface acoustic wave (SAW) band-pass filter configured to pass a transmit frequency band and a tunable transmitter impedance matching network in series. The tunable transmitter impedance matching network matches an input impedance of the SAW band-pass filter to the output impedance of a power amplifier over a portion of the transmit frequency band in response to a tuning input.

Abstract: Methods of designing band-pass filters are disclosed. A baseline filter design is established, the baseline filter design including a plurality of surface acoustic wave resonators having respective resonant frequencies, the surface acoustic wave resonators organized by resonant frequency into two or more groups. One or more alternative filter designs are established, each alternative filter design derived from the baseline filter design by reordering the resonant frequencies of two or more surface acoustic wave resonators within at least one of the two or more groups. A respective performance metric related to input impedance over a pass band is calculated for each of the baseline filter design and the alternative filter designs. A final filter design is selected from the baseline filter design and the alternative filter designs based on the respective performance metrics.

Abstract: Methods of designing band-pass filters and filters are disclosed. A baseline filter design meeting first design criteria may be established, the baseline filter design including a plurality of series surface acoustic wave resonators and a plurality of shunt surface acoustic wave resonators, each surface acoustic wave resonator having a respective resonant frequency. A performance metric based on an input impedance of the baseline filter design over a pass band may be determined. One or more alternate filter designs may be established and respective performance metrics determined, each alternative filter design established by reordering the resonant frequencies of two or more of the plurality of series surface acoustic wave resonators and/or two or more of the plurality of shunt surface acoustic wave resonators. A final filter design may be selected from the baseline design and the one or more alternate filter designs based on the respective performance metrics.

Abstract: Filter devices and duplexer devices are disclosed. A filter device includes two or more surface acoustic wave resonators, including at least a first shunt resonator, formed on a surface of a substrate. A ground conductor formed on the surface of the substrate connects the first shunt resonator to a ground pad. At least a portion of an edge of the ground conductor is shaped as a plurality of serrations.

Abstract: Filer devices and duplexer devices are disclosed. A filter device includes two or more surface acoustic wave resonators, including at least a first shunt resonator, formed on a surface of a substrate. A ground conductor formed on the surface of the substrate connects the first shunt resonator to a ground pad. At least a portion of an edge of the ground conductor is shaped as a plurality of serrations.

Abstract: A filter includes two or more surface acoustic wave resonators formed on a surface of a substrate and at least one ground conductor formed on the surface of the substrate. At least a portion of an edge of the ground conductor is formed as a plurality of serrations.

Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.