Patents by Inventor James R. Eckert

James R. Eckert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal system for semiconductor die attach
    Patent number: 5105258
    Abstract: A layer of aluminum is formed on a surface of a thermal expansion buffer which is used in a semiconductor package. A semiconductor die is attached to the aluminum using a die attach material. An electrical connection for the die is created by attaching a wire from the semiconductor die to the aluminum surface of the buffer. This provides a reliable semiconductor package useful in a high temperature environment.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: April 14, 1992
    Assignee: Motorola, Inc.
    Inventors: Duane C. Silvis, Udey Chaudhry, James R. Eckert, Edward J. Mischen