Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.

Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.