Abstract: A crystal oven for radio frequency control crystals includes a crystal socket board, mounted directly on one side of a printed circuit board. The crystal sockets extend through and are soldered to corresponding cyrstal socket terminals on the opposite side of the printed circuit board. A housing surrounds the crystal socket board and is attached to the printed circuit board. An oven temperature control circuit including a power transistor controls the amount of current flowing through a heating wire, which is wrapped around and mounted to the housing. The collector plate of the power transistor is mounted to a heat sink, which overlies the crystal socket terminals. Heat generated by the collector plate as a result of current through the power transistor is distributed across the heat sink and is transferred by convection to the crystal socket terminals to reduce the amount of heat transfer through the crystal socket terminals.