Abstract: Die plates for forming moisture seals about the junctions of wire harnesses afford improved wire separation and contact between the sealant material in a sealant pad and the wires if the opposed die plates have an elastomeric surface, and the opposed surface of at least one plate is radiused causing the sealant material to separate the wires and flow between and around each wire.

Abstract: A method and arrangement are provided to generate an environmental seal around a connection such as an electrical junction. The arrangement comprises a pad arrangement having a substrate and a sealant pad associated therewith. The sealant pad comprises a highly viscous sealant which, under pressure, can be forced into areas between adjacent wires, to provide effective moisture seals. According to preferred methods of the present invention a substrate having sealant thereon is folded around a junction to be sealed, such that the substrate retains the sealant against the electrical junction. In a step of the preferred method, pressure is applied to the enclosed sealant pad, generating hydraulic forces contained in such a manner as to the direct sealant between adjacent wires, spreading same apart. In preferred applications, preferred direction of sealant is facilitated by a preferred pressure die arrangement.