Abstract: The invention provides processes for marker assisted selection of common beans expressing volatile compounds that provide flavor traits associated with single nucleotide polymorphisms (SNPs) and/or sequences flanking SNPs, as well as allele-specific oligo sequence primers configured to anneal to related SNPs and to report the presence or absence of SNPs with fluorescent signals using a PCR assay, a KASP assay (i.e., modified PCR assay), or other molecular marker assay, e.g., SSR, capable of identifying the presence or absence of SNPs and/or portions of flanking sequences of the SNPs, all of which enhances selection efficiency in common bean breeding strategies.

Abstract: The invention provides processes for marker assisted selection of common beans expressing volatile compounds that provide flavor traits associated with single nucleotide polymorphisms (SNPs) and/or sequences flanking SNPs, as well as allele-specific oligo sequence primers configured to anneal to related SNPs and to report the presence or absence of SNPs with fluorescent signals using a PCR assay, a KASP assay (i.e., modified PCR assay), or other molecular marker assay, e.g., SSR, capable of identifying the presence or absence of SNPs and/or portions of flanking sequences of the SNPs, all of which enhances selection efficiency in common bean breeding strategies.

Abstract: The invention provides processes for marker assisted selection of common beans expressing volatile compounds that provide flavor traits associated with single nucleotide polymorphisms (SNPs) and/or sequences flanking SNPs, as well as allele-specific oligo sequence primers configured to anneal to related SNPs and to report the presence or absence of SNPs with fluorescent signals using a PCR assay, a KASP assay (i.e., modified PCR assay), or other molecular marker assay, e.g., SSR, capable of identifying the presence or absence of SNPs and/or portions of flanking sequences of the SNPs, all of which enhances selection efficiency in common bean breeding strategies.

Abstract: The invention provides processes for marker assisted selection of common beans expressing volatile compounds that provide flavor traits associated with single nucleotide polymorphisms (SNPs) and/or sequences flanking SNPs, as well as allele-specific oligo sequence primers configured to anneal to related SNPs and to report the presence or absence of SNPs with fluorescent signals using a PCR assay, a KASP assay (i.e., modified PCR assay), or other molecular marker assay, e.g., SSR, capable of identifying the presence or absence of SNPs and/or portions of flanking sequences of the SNPs, all of which enhances selection efficiency in common bean breeding strategies.

Abstract: An annular spring assembly includes an annular spring, an annular first container including a first well and an annular second container including a second well. The first well and second well open towards one another and hold the annular spring therebetween. The second well is configured to telescopically receive the first well when the annular spring is compressed.

Abstract: The present invention is for a firearm sound suppressor which is attached to the barrel of a firearm to reduce the noise and flash generated by the firearm. The firearm sound suppressor improves the dissipation of heat and provides a breach head on the end thereof for use as a ramming and breaching instrument.

Abstract: A vehicle includes a chassis having a frame member, and a suspension system carried by the chassis. One or more air spring assemblies are associated with the suspension system, with each air spring assembly having an air bag, an air line and an air valve. An inflation valve bracket includes a channel and a flange depending from the channel. The channel is at least partially wrapped around the frame member. The flange has one or more openings with a corresponding air valve in each opening.

Abstract: A vehicle includes a chassis having a frame member, and a suspension system carried by the chassis. One or more air spring assemblies are associated with the suspension system, with each air spring assembly having an air bag, an air line and an air valve. An inflation valve bracket includes a channel and a flange depending from the channel. The channel is at least partially wrapped around the frame member. The flange has one or more openings with a corresponding air valve in each opening.

Abstract: An annular spring assembly includes an annular spring, an annular first container including a first well and an annular second container including a second well. The first well and second well open towards one another and hold the annular spring therebetween. The second well is configured to telescopically receive the first well when the annular spring is compressed.

Abstract: The present invention is for a firearm sound suppressor which is attached to the barrel of a firearm to reduce the noise and flash generated by the firearm. The firearm sound suppressor improves the dissipation of heat and provides a breach head on the end thereof for use as a ramming and breaching instrument.

Abstract: The present invention is for a firearm sound suppressor which is attached to the barrel of a firearm to reduce the noise and flash generated by the firearm. The firearm sound suppressor improves the dissipation of heat and provides a breach head on the end thereof for use as a ramming and breaching instrument.

Abstract: The present invention is for a firearm sound suppressor which is attached to the barrel of a firearm to reduce the noise and flash generated by the firearm. The firearm sound suppressor improves the dissipation of heat and provides a breach head on the end thereof for use as a ramming and breaching instrument.

Abstract: An HVAC connector is disclosed that includes a one-piece conduit. The conduit includes a generally planar, rectangular mounting flange that defines an air inlet into the conduit. A first body portion extends from the mounting flange and a second body portion extends from the first body portion to define a generally tubular takeoff neck having a round outlet that is disposed generally parallel to the mounting flange.

Abstract: A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.

Abstract: Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops configured to limit a bond line distance between the rigid body and the heat source. A thermal interface material may be disposed in the bond line between the heat source and the lid. The thermal interface material may be adapted to provide a thermally conductive adhesive bond between the lid and the heat source.

Abstract: An internally-sealed pass-through electrical connector includes electrical conductors for carrying electrical signals through the electrical connector, a connector body or shell surrounding the connector, and an organic adhesive material within the body or shell that fills space around the conductors and between the conductors and the connector body. The connector body includes a metal portion, such as an aluminum portion, that has a roughened surface to better allow the adhesive to adhere to it. The roughened surface may be a grit blasted surface. The connector body may also include a plastic portion, such as a molded lead organizer, to aid in positioning the leads. The adhesive may have a coefficient of thermal expansion that is matched to that of the metal portion of the connector body or shell. The organic adhesive may be an epoxy material. The electrical connector may have any of a variety of configurations.

Abstract: A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.

Abstract: The present invention provides a method and system for managing a cardholder's payment card account having a non-changing account number associated with a payment card, the method comprising the steps of assigning a series of dynamic attributes to an account number, identifying the payment card account, and changing the dynamic attributes of the account number without changing the account number.

Abstract: The present invention comprises a three-axis damping system employing dampers and springs in spatially oriented arrays to isolate an object against translational forces in any direction as well as rotational forces. The inventive system also is biased in the vertical static position to compensate for gravity.