Abstract: Improved encapsulating compositions for inductive devices are provided. The composition has a polybutadiene base and contains an initiator, an inhibitor and a co-agent for improving the curing of the composition under the influence of the initiator.Certain compositions are usable at higher temperatures than prior polybutadiene base encapsulating compounds based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature encapsulating system is achieved.Certain compositions are usable to provide a soft cure encapsulation from which an encapsulated inductive device may be liberated without damage to the device. For such compositions, soft curable polybutadienes are employed and particularly those having high trans and cis components.

Abstract: Encapsulating compositions for inductive devices have a polybutadiene base, predominate in trans-1,4 polybutadiene, and include cis-1,4 polybutadiene and vinyl-1,2 polybutadiene, together with an initiator, an inhibitor and a co-agent for improving the curing of the composition. The compositions are usable at higher temperatures, based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature soft cure encapsulation is achieved from which an inductive device may be liberated without damage to the device.