Abstract: A component supply tape is stepped to present each pocket at a component pick-up area, and a top cover of the tape is peeled back so that each pocket is opened in turn. A shutter is positioned over the pick-up area prior to tape movement so that the pocket is covered by the shutter as the top cover is peeled from the substrate. After each indexing step, the shutter is actuated to uncover the opened pocket which is situated at the pick-up area for retrieval by the vacuum nozzle of a pick-and-place head. By the improved method and apparatus of the instant invention, the pick and place head is provided with a finger for opening the shutter of the feeder while the vacuum nozzle is advanced along a normal to the pick-up surface of the component, so as to minimize the period of time that the component is uncovered.

Abstract: In a preferred embodiment, the supply tape is stepped to present each pocket at a pick-up area for removal of a component. Each pocket is opened in turn during the indexing step that positions it at the pick-up area, and a shutter is moved over the pick-up area prior to tape movement so that the pocket is covered by a shutter during the tape movement and peeling of the cover from the substrate. After each indexing step, the shutter is moved away from the pick-up area in order to provide access to the component in the opened pocket.