Abstract: An exhaust gas sensor that includes a sensor element having a cup-shaped member including an outer surface and an inner surface defining a cavity. The cup-shaped member further includes an exhaust electrode coupled to the outer surface and a reference electrode coupled to the inner surface. The exhaust gas sensor further includes a heating element located within the cavity and a heat conductive material within the cavity and between the inner surface of the cup-shaped member and the heating element to facilitate heat transfer from the heating element to the sensor element.

Abstract: A microbolometer IR FPA is provided with in-situ vacuum sensing capability by realizing that the IR sensor microbolometer pixel element itself may be used as a vacuum sensor. The application of an electrical signal to the resistive element heats the bolometer material thereby producing a variable resistance related to vacuum level. The degree of variability for a given material depends on the efficiency of heat transfer from the material to the surrounding environment. In a good vacuum, heat transfer is poor, and thus heat will be retained in the material to produce a relatively large temperature increase and the resistance variability will be large. In a poor vacuum, heat is readily transferred to the environment and the temperature rise will be relatively small and thus resistance variability will be small. Consequently, the variable resistance magnitude can be readout to determine the vacuum level.

Abstract: A metal to semiconductor contact is provided wherein the Schottky barrier ight is about 1 eV and independent of the contact metal. The metal, such as Au, Cr, or Ti, is deposited on a heavily doped p-type layer of silicon which is about 15 to 30 angstroms thick. The interface layer is deposited on gallium arsenide.

Abstract: The invention is a layered nonalloyed ohmic contact structure for use on n type gallium arsenide including a layer of germanium or silicon of the order of 10 .ANG. thick evaporated onto the gallium arsenide; a diffusion barrier layer of material 100-200 .ANG. thick over the germanium or silicon selected from non-metallic conducting compounds, including metal compounds ofarsenidephosphidecarbideboridenitridesilicideand non-metallic conducting elements; with the diffusion barrier layer material characterized by resistivity of the order of 1 ohm cm or less; and a conducting metal overlayer on the diffusion barrier layer. The invention includes the method for manufacturing the contact structure.

Abstract: A photovoltaic cell structure is fabricated from an active medium including an undoped, intrinsically p-type organic semiconductor comprising polyacetylene. When a film of such material is in rectifying contact with a magnesium electrode, a Schottky-barrier junction is obtained within the body of the cell structure. Also, a gold overlayer passivates the magnesium layer on the undoped polyacetylene film.