Abstract: A flexible cooling loop for providing a thermal path between a heat source and a heat sink includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality if mechanically flexible tubing sections configured for connecting the mechanically rigid tubing sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: The present invention is a magnetic pump assembly for integration with a mechanically flexible thermal spreader. The assembly may include a casing which may be connectable to a mechanically flexible substrate of the thermal spreader. The assembly may further include a plurality of magnets which may be integrated with and enclosed by the casing. The magnets may be suitable for applying a magnetic field to an electrically-conductive liquid, and may be implemented in combination with electrodes, which may be integrated with the substrate and may be suitable for generating an electrical current flow through the liquid. The magnets and electrodes may combine to provide a pumping force for circulating the liquid within an internal channel of an electrically-conductive cooling loop of the substrate. The assembly may further include a thermally-conductive rigid metal insert integrated with the casing. The assembly may promote local thermal conductivity of the thermal spreader.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: A tamper resistant semiconductor package includes a surface having flip chip electrical contacts. A flip chip semiconductor of the package also has flip chip electrical contacts. The flip chip semiconductor has a maximum temperature to which it can be exposed before being damaged. Flip chip solder joints physically couple and electrically connect the flip chip electrical contacts of the flip chip semiconductor to the flip chip electrical contacts of the surface. The flip chip solder joints are formed of an alloy having a higher melting point than the maximum temperature such that removal of the flip chip semiconductor from the surface by heating will destroy the functionality of the flip chip semiconductor.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: The present invention is a magnetic pump assembly for integration with a mechanically flexible thermal spreader. The assembly may include a casing which may be connectable to a mechanically flexible substrate of the thermal spreader. The assembly may further include a plurality of magnets which may be integrated with and enclosed by the casing. The magnets may be suitable for applying a magnetic field to an electrically-conductive liquid, and may be implemented in combination with electrodes, which may be integrated with the substrate and may be suitable for generating an electrical current flow through the liquid. The magnets and electrodes may combine to provide a pumping force for circulating the liquid within an internal channel of an electrically-conductive cooling loop of the substrate. The assembly may further include a thermally-conductive rigid metal insert integrated with the casing. The assembly may promote local thermal conductivity of the thermal spreader.

Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: A mosaic display system includes a number of tiles. Each of the tiles includes a matrix of pixel elements. The pixel elements selectively provide light at a first surface of the tile in response to address signals. The pixel elements are coupled to an address circuit via conductors at a second surface. The first surface is opposite the second surface. The display system also includes a medium having a mounting surface. The tiles are attached to or above the mounting surface.

Abstract: An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.

Abstract: An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.