Patents by Inventor James R. Zanolli
James R. Zanolli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7829791Abstract: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.Type: GrantFiled: December 29, 2008Date of Patent: November 9, 2010Assignee: Interplex Nas, Inc.Inventors: Jack Seidler, James R. Zanolli, Joseph S. Cachina
-
Patent number: 7758350Abstract: An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.Type: GrantFiled: February 27, 2008Date of Patent: July 20, 2010Assignee: Teka Interconnection SystemsInventors: James R. Zanolli, Joseph S. Cachina
-
Publication number: 20100067209Abstract: A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.Type: ApplicationFiled: May 31, 2007Publication date: March 18, 2010Applicant: Teka Interconnection SystemsInventor: James R Zanolli
-
Publication number: 20090173517Abstract: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.Type: ApplicationFiled: December 29, 2008Publication date: July 9, 2009Applicant: Interplex NAS, Inc.Inventors: Jack Seidler, James R. Zanolli, Joseph S. Cachina
-
Publication number: 20080268676Abstract: An electrical connector for electrically connecting a first electronic device to a second electronic device includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.Type: ApplicationFiled: February 27, 2008Publication date: October 30, 2008Applicant: Teka Interconnections Systems, Inc.Inventors: James R. Zanolli, Joseph S. Cachina
-
Patent number: 6900393Abstract: A solder bearing—bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and second surface, opposing the first surface. The first surface has grooves (115, 117) formed therein and includes length of solder (130) dispersed within groove. Upon heating the solder and placement of the wafer between the first and second devices, the two devices are connected.Type: GrantFiled: September 20, 2000Date of Patent: May 31, 2005Assignee: Teka Interconnections Systems, Inc.Inventors: Joseph S. Cachina, James R. Zanolli
-
Patent number: 6543129Abstract: The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto.Type: GrantFiled: March 7, 2001Date of Patent: April 8, 2003Assignee: Teka Interconnections Systems, Inc.Inventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Patent number: 6494754Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: GrantFiled: January 2, 2002Date of Patent: December 17, 2002Assignee: North American SpecialtiesInventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Patent number: 6402574Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: GrantFiled: December 29, 1997Date of Patent: June 11, 2002Assignee: North American Specialties CorporationInventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Publication number: 20020061687Abstract: The present invention provides a solder ball grid array (SBGA) type connector and method of manufacture thereof. The SBGA connector includes a number of contacts which each have a solder ball formed at one end thereof. According to the present invention the solder ball is formed by disposing and retaining a solder mass along a body of the contact. The contact is then heated to a predetermined temperature resulting in the solder mass reflowing to one end of the body so that a solder ball is formed at the one end.Type: ApplicationFiled: November 21, 2001Publication date: May 23, 2002Applicant: TEKA INTERCONNECTIONS SYSTEMS, INC.Inventors: Joseph S. Cachina, James R. Zanolli
-
Publication number: 20020058446Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: ApplicationFiled: January 2, 2002Publication date: May 16, 2002Applicant: North American Specialties CorporationInventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Publication number: 20010045009Abstract: The present invention provides a method of forming a forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in an electrical connector and more particularly, for use in a solder ball grid array (SBGA) connector. Generally and according to one embodiment, the method includes providing the contact along with a solder-holding clip having a body with an opening. The body has a solder-holding conformation adjacent the opening and a solder mass is held by the conformation. The contact is then positioned proximate to the body opening and heat is applied to the solder mass causing the solder to reflow so that the solder flows into a spherical shape. This results in a solder ball being formed on the portion of the contact. Subsequent to forming the solder ball, the solder-holding clip is separated from the contact leaving a contact with a solder ball affixed thereto.Type: ApplicationFiled: March 7, 2001Publication date: November 29, 2001Inventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Publication number: 20010041481Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: ApplicationFiled: December 29, 1997Publication date: November 15, 2001Inventors: JOSEPH CACHINA, JACK SEIDLER, JAMES R. ZANOLLI
-
Patent number: 6206735Abstract: A press fit contact for through hole mounting has a longitudinal axis and a contact portion along the axis for mounting with an associated electrical component to make electrical contact therewith. A leg portion is configured and dimensioned to be inserted through a mounting plated through hole of a support member. The leg portion includes an interference element along at least a portion thereof dimensioned to be receivable within the plated through hole to establish a press-fit or interference-fit and mechanical and electrical contact with the plating on the mounting hole. An intermediate portion is provided between and integrally formed with the contact and leg portions, the portions all being generally aligned along the longitudinal axis. A pressure-bearing, in each instance element, in the form of one or more holes and with or without associated blade tabs, is formed on the intermediate portion within the perimeter or inside the lateral edges defined by the intermediate portion.Type: GrantFiled: August 28, 1998Date of Patent: March 27, 2001Assignee: Teka Interconnection Systems, Inc.Inventor: James R. Zanolli
-
Patent number: 6099365Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: GrantFiled: December 29, 1997Date of Patent: August 8, 2000Assignee: North American Specialties CorporationInventors: Joseph Cachina, Jack Seidler, James R. Zanolli
-
Patent number: 5875546Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.Type: GrantFiled: October 7, 1996Date of Patent: March 2, 1999Assignee: North American Specialties CorporationInventors: Joseph Cachina, Jack Seidler, James R. Zanolli