Abstract: A plasma processing chamber for depositing a film on an underside surface of a wafer, includes a showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer.

Abstract: A plasma processing chamber for depositing a film on an underside surface of a wafer, includes showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. An upper separator fin is disposed over a top surface of the showerhead pedestal and a lower separator fin is disposed under the top surface of the showerhead pedestal and aligned with the upper separator fin. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer. In another embodiment, a top surface of the showerhead pedestal may be configured to receive a masking plate instead of the upper separator fin. The masking plate is configured with a first area that has openings and a second area that is masked. The first areas is used to provide the process gas to a portion of the underside surface of the wafer for depositing a film.

Abstract: A system and method for blasting an overhead surface is disclosed herein. The blaster system can comprise a first enclosure, a second enclosure, a pair of recirculators, a pair of loader valves, and a pair of propeller assemblies. The first enclosure can comprise a pair of primary ports, and a pair of control cages. The pair of primary ports can be at the front surface of the first enclosure. The primary ports can receive abrasive material. The pair of control cages can be attached at the bottom surface of the first enclosure forming a pair of curved surfaces, and a plurality of gaps. Each of the curved surface can comprise a slot. Each end of the slot can rest within each of the gaps such that the abrasive material received within the first enclosure can collect within the gaps and falls into the slot.