Patents by Inventor James Reginelli
James Reginelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10861690Abstract: The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound.Type: GrantFiled: October 6, 2015Date of Patent: December 8, 2020Assignee: Consumer Lighting (U.S.), LLCInventors: Gary Robert Allen, Dengke Cai, Thomas Clynne, Jianmin He, Cherian Jacob, James Reginelli, Joshua Ian Rintamaki, Zhiyong Wang
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Patent number: 10340424Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: October 24, 2013Date of Patent: July 2, 2019Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 10309587Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: May 3, 2013Date of Patent: June 4, 2019Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, Jr., Thomas F. Soules
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Publication number: 20180080614Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: May 3, 2013Publication date: March 22, 2018Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, JR., Thomas F. Soules
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Publication number: 20160097496Abstract: The specification and drawings present a new apparatus such as a lighting apparatus, the apparatus comprising at least one LED (or OLED) module, configured to generate a visible light such as white light, and at least one component such as optical component comprising a compound consisting essentially of the elements neodymium (Nd) and fluorine (F), and optionally including one or more other elements. The lighting apparatus is configured to provide a desired light spectrum by filtering the generated visible light using the compound.Type: ApplicationFiled: October 6, 2015Publication date: April 7, 2016Inventors: Gary Robert ALLEN, Dengke CAI, Thomas CLYNNE, Jianmin HE, Cherian JACOB, James REGINELLI, Joshua Ian RINTAMAKI, Zhiyong WANG
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Publication number: 20140328046Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: May 3, 2013Publication date: November 6, 2014Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Publication number: 20140049965Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: October 24, 2013Publication date: February 20, 2014Applicant: GE LIGHTING SOLUTIONS, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 8436380Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: September 17, 2010Date of Patent: May 7, 2013Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 8362695Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: September 17, 2010Date of Patent: January 29, 2013Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Publication number: 20110018014Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: September 17, 2010Publication date: January 27, 2011Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Publication number: 20110001422Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: September 17, 2010Publication date: January 6, 2011Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 7842960Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).Type: GrantFiled: September 6, 2006Date of Patent: November 30, 2010Assignee: Lumination LLCInventors: James Reginelli, Srinath K. Aanegola, Emil Radkov
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Patent number: 7800121Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: December 20, 2005Date of Patent: September 21, 2010Assignee: Lumination LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 7749813Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.Type: GrantFiled: February 27, 2008Date of Patent: July 6, 2010Assignee: Lumination LLCInventors: Boris Kolodin, James Reginelli
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Patent number: 7717591Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.Type: GrantFiled: December 27, 2007Date of Patent: May 18, 2010Assignee: Lumination LLCInventors: Stanton E. Weaver, Jr., James Reginelli
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Publication number: 20090212317Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.Type: ApplicationFiled: February 27, 2008Publication date: August 27, 2009Inventors: Boris Kolodin, James Reginelli
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Publication number: 20090166653Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.Type: ApplicationFiled: December 27, 2007Publication date: July 2, 2009Applicant: Lumination LLCInventors: Stanton E. Weaver, JR., James Reginelli
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Publication number: 20080054280Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).Type: ApplicationFiled: September 6, 2006Publication date: March 6, 2008Inventors: James Reginelli, Srinath K. Aanegola, Emil Radkov
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Publication number: 20080035947Abstract: A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.Type: ApplicationFiled: December 9, 2004Publication date: February 14, 2008Inventors: Stanton Earl Weaver Jr., Chen-Lun Hsing Chen, Boris Kolodin, Thomas Elliot Stecher, James Reginelli, Deborah Ann Haitko, Xiang Gao, Ivan Eliashevich
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Patent number: D658788Type: GrantFiled: April 7, 2010Date of Patent: May 1, 2012Assignee: GE Lighting Solutions LLCInventors: David C. Dudik, Gary R. Allen, Charles L. Huddleston, II, Joshua I. Rintamaki, Glenn H. Kuenzler, James Reginelli