Patents by Inventor James Richard Stack

James Richard Stack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board wireability enhancement
    Patent number: 6232564
    Abstract: A printed circuit board having a signal plane with increased channel width for enhanced wireability. The printed circuit board has a top plane having component lands arranged in a grid, wherein the component lands include a first grouping arranged in a first diagonal, and a second grouping arranged in a second diagonal where the second diagonal is parallel and adjacent to the first diagonal, a plurality of offset lands placed within the first diagonal between the component lands therein, and a plurality of electrical connectors electrically coupling component lands in the second diagonal to adjacent offset lands in the first diagonal.
    Type: Grant
    Filed: October 9, 1998
    Date of Patent: May 15, 2001
    Assignee: International Business Machines Corporation
    Inventors: Steven Frederick Arndt, Mark Budman, James Richard Stack
  • Clover-leaf solder mask opening
    Patent number: 6150061
    Abstract: A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.
    Type: Grant
    Filed: January 17, 2000
    Date of Patent: November 21, 2000
    Assignee: International Business Machines Corporation
    Inventor: James Richard Stack
  • Clover-leaf solder mask opening
    Patent number: 6078013
    Abstract: A solder mask having a clover-leaf shaped opening around a PTH for enhanced performance. The solder mask resides on a surface of a printed circuit board comprising lands and PTH's. The opening around the PTH is configured to maintain a minimum channel width between the PTH and an adjacent land while maximizing the opening around the PTH, thereby decreasing the likelihood that the solder mask material will be inadvertently drawn into the PTH.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: June 20, 2000
    Assignee: International Business Machines Corporation
    Inventor: James Richard Stack