Abstract: A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, a polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Abstract: A curable polymeric composition which is a liquid at 20° C. and which comprises 25 to 60% by weight of a resin component which comprises an epoxy, 5 to 25% by weight of a curing agent which comprises two components, a first component which is a cycloaliphatic amine or an aromatic amine, and a second component which is a polyamide amine, and 20 to 65% by weight of an inert inorganic filler. The curable composition can be used in a method of protecting a substrate such as a pipe or a pipe joint from corrosion or mechanical damage. In the method, the curable composition is first applied to the substrate, polymeric covering layer is applied over the curable composition with an innermost layer of a heat-activatable sealant in intimate contact with the curable composition, and the curable composition is then cured. During the curing process, the heat-activatable sealant, e.g. a hot melt adhesive, remains in contact with the curable composition and interacts therewith.

Abstract: Curable compositions which are useful for encapsulating electrical connections and for joining metals to metals, and which comprise a mixture of high and low molecular weight fluorocarbon elastomers. Preferred compositions comprise a mixture of three fluorocarbon elastomers, the first having a Mooney viscosity at 121.degree. C. of at least 120, the second a Mooney viscosity at 121.degree. C. of 80 to 110, and the third a Brookfield viscosity at 100.degree. C. of 1,000 to 4,000 centipoises, in amounts 5 to 50%, 25 to 70% and 5 to 50% respectively, based on the weight of the polymeric component. The compositions can be easily molded under heat and pressure, and after they have been cured, they have remarkable resistance to degradation by hot liquids, even under pressure. Consequently, the compositions are very useful in the manufacture of self-regulating heaters for use in heating the production tubes of oil wells.

Abstract: Curable compositions which are useful for encapsulating electrical connections and for joining metals to metals, and which comprise a mixture of high and low molecular weight fluorocarbon elastomers. Preferred compositions comprise a mixture of three fluorocarbon elastomers, the first having a Mooney viscosity at 121.degree. C. of at least 120, the second a Mooney viscosity at 121.degree. C. of 80 to 110, and the third a Brookfield viscosity at 100.degree. C. of 1,000 to 4,000 centipoises, in amounts 5 to 50%, 25 to 70% and 5 to 50% respectively, based on the weight of the polymeric component. The compositions can be easily molded under heat and pressure, and after they have been cured, they have remarkable resistance to degradation by hot liquids, even under pressure. Consequently, the compositions are very useful in the manufacture of self-regulating heaters for use in heating the production tubes of oil wells.