Patents by Inventor James Robert Amos Bardeen
James Robert Amos Bardeen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9537794Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.Type: GrantFiled: July 30, 2012Date of Patent: January 3, 2017Assignee: VUBIQ NETWORKS, INC.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20160013534Abstract: A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed.Type: ApplicationFiled: July 20, 2015Publication date: January 14, 2016Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 9088058Abstract: A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.Type: GrantFiled: August 19, 2010Date of Patent: July 21, 2015Assignee: Vubiq Networks, Inc.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 8897184Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.Type: GrantFiled: July 30, 2012Date of Patent: November 25, 2014Assignee: Vubiq Networks, Inc.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20140233460Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.Type: ApplicationFiled: July 30, 2012Publication date: August 21, 2014Applicant: VUBIQ INCORPORATEDInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 8477070Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.Type: GrantFiled: August 3, 2010Date of Patent: July 2, 2013Assignee: Vubiq, Inc.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20130107853Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.Type: ApplicationFiled: July 30, 2012Publication date: May 2, 2013Applicant: VUBIQ INCORPORATEDInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 8422414Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.Type: GrantFiled: April 12, 2011Date of Patent: April 16, 2013Assignee: Vubiq IncorporatedInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20120194303Abstract: A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.Type: ApplicationFiled: August 19, 2010Publication date: August 2, 2012Applicant: VUBIQ INCORPORATEDInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20110188417Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.Type: ApplicationFiled: April 12, 2011Publication date: August 4, 2011Applicant: VUBIQ INCORPORATEDInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20110181484Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.Type: ApplicationFiled: August 3, 2010Publication date: July 28, 2011Applicant: VUBIQ, INC.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 7929474Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.Type: GrantFiled: June 23, 2008Date of Patent: April 19, 2011Assignee: Vubiq IncorporatedInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Patent number: 7768457Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.Type: GrantFiled: February 15, 2008Date of Patent: August 3, 2010Assignee: Vubiq, Inc.Inventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20090207090Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.Type: ApplicationFiled: February 15, 2008Publication date: August 20, 2009Applicant: Vubiq IncorporatedInventors: Michael Gregory Pettus, James Robert Amos Bardeen
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Publication number: 20090028177Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.Type: ApplicationFiled: June 23, 2008Publication date: January 29, 2009Applicant: Vubiq IncorporatedInventors: Michael Gregory Pettus, James Robert Amos Bardeen