Patents by Inventor James Robert Mathews

James Robert Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 3974518
    Abstract: An hermetic sealed microwave diode package having high thermal conductivity and very low parasitic impedances. The diode chip is mounted upon a diamond member embedded in a copper base member so that the diamond mounting surface and the copper base member surface are coplanar. A fused silica insulator ring produced by selective grit blasting surrounds the chip and is mounted likewise entirely on the diamond surface. The silica insulator has a height comparable to the thickness of the semiconductor chip and the enclosure is completed by a metal covering member which includes a contact to the top surface of the diode chip. The package thereby has extremely short conductive paths and low capacitance by virtue of the very small silica insulator ring.
    Type: Grant
    Filed: February 21, 1975
    Date of Patent: August 10, 1976
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Basil Charles Lewis, Jr., James Robert Mathews, Louis Henry Von Ohlsen, Jr.