Abstract: The present invention provides process for producing a ballistic-resistant molded article, which molded article comprises: i) a plurality of layers of unidirectionally aligned polyolefin fibers, which layers are substantially absent a bonding matrix; and ii) a plurality of layers of adhesive, and which process comprises: a) providing a plurality of precursor sheets, each of said precursor sheets comprising i) at least one layer of unidirectionally aligned polyolefin fibers which layer is substantially absent a bonding matrix, and ii) at least one layer of adhesive; b) stacking said precursor sheets to form a stack, wherein the total amount of adhesive in the stack is from 5.0 to 12.0 wt. % based on the total weight of the stack; c) pressing the stack produced in step b) at a temperature of from 1 to 30° C. below the melting point of the polyolefin fibers and at a pressure of at least 8 MPa; and d) cooling the pressed stack produced in step c) to at least 50° C.

Abstract: Apparatus and methods for plasma processing of a substrate in a processing chamber are provided. In one example, an apparatus is provided that includes reducing defectivity in features formed on the surface of a substrate, improving plasma etch rate, and increasing selectivity of etching material to mask and/or etching material to stop layer. In another example, a method is provided that includes the synchronization of the delivery of pulsed-voltage (PV) waveforms, and alternately the delivery of a PV waveform and a radio frequency (RF) waveform, so as to allow for the independent control of generation of electrons that are provided, during one or more stages of a PV waveform cycle, to neutralize the trapped charges formed in the features formed on the substrate.

Abstract: Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a negative jump voltage to an electrode of a process chamber to set a wafer voltage for a wafer, modulating an amplitude of the wafer voltage to produce a train of groups of pulse bursts with different amplitudes, and repeating the modulating of the amplitude of the wafer voltage to repeat the train of the groups of pulse bursts to create an ion energy distribution function having more than one energy peak. In some embodiments, the negative jump voltage can include a single-cycle voltage waveform with a voltage ramp during an ion-current phase, in which the voltage ramp can be positive or negative and a duration of the ion-current phase can comprise more or less than fifty percent of a period of the waveform.

Abstract: Embodiments described herein provide methods and apparatus used to control a processing result profile proximate to a circumferential edge of a substrate during the plasma-assisted processing thereof. In one embodiment, a substrate support assembly features a first base plate and a second base plate circumscribing the first base plate. The first and second base plates each have one or more respective first and second cooling disposed therein. The substrate support assembly further features a substrate support disposed on and thermally coupled to the first base plate, and a biasing ring disposed on and thermally coupled to the second base plate. Here, the substrate support and the biasing ring are each formed of a dielectric material. The substrate support assembly further includes an edge ring biasing electrode embedded in the dielectric material of the biasing ring and an edge ring disposed on the biasing ring.

Abstract: An electric compressor includes a housing, refrigerant inlet port, a refrigerant outlet port, an inverter section, a motor section, a compression device and a front cover. The housing defines an intake volume and a discharge volume. The refrigerant inlet port is coupled to the housing and is configured to introduce the refrigerant to the intake volume. The compression device is a scroll-type compression device configured to compress the refrigerant. The refrigerant outlet port is coupled to the housing and is configured to allow compressed refrigerant to exit the scroll-type electric compressor from the discharge volume. The electric compressor including a scroll backpressure system, located at least partially, within a compression device body.

Abstract: Embodiments provided herein generally include plasma processing systems configured to preferentially clean desired surfaces of a substrate support assembly by manipulating one or more characteristics of an in-situ plasma and related methods. In one embodiment, a plasma processing method includes generating a plasma in a processing region defined by a chamber lid and a substrate support assembly, exposing an edge ring and a substrate supporting surface to the plasma, and establishing a pulsed voltage (PV) waveform at the edge control electrode.

Abstract: Embodiments provided herein include an apparatus and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to reducing defectivity in features formed on the surface of the substrate, improving plasma etch rate, and increasing selectivity of etching material to mask and/or etching material to stop layer. In some embodiments, the apparatus and methods enable processes that can be used to prevent or reduce the effect of trapped charges, disposed within features formed on a substrate, on the etch rate and defect formation.

Abstract: Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias voltage signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. Embodiments of the disclosure include a method and apparatus for synchronizing a pulsed radio frequency (RF) waveform to a pulsed voltage (PV) waveform, such that the pulsed RF waveform is on during a first stage of the PV waveform and off during a second stage. The first stage of the PV waveform includes a sheath collapse stage. The second stage of the PV waveform includes an ion current stage.

Abstract: An electric scroll compressor configured to compress a refrigerant for use with a vapor injection system, is provided. The compressor includes refrigerant inlet and outlet ports and a vapor injection port. The housing includes a vapor injection cavity and at least one vapor injection channel which are integral therewith. A compression device includes a fixed scroll and an orbiting scroll. The orbiting scroll and the fixed scroll form compression chambers for receiving the refrigerant from the intake volume and compressing the refrigerant as the drive shaft is rotated about the center axis. The fixed scroll includes at least one vapor outlet aperture in communication with the at least one vapor injection channel for allowing vapor to enter a compression chamber formed between the fixed scroll and the orbiting scroll.

Abstract: The present disclosure relates to a protective ring for an edge electrode, an edge voltage delivery system, and a substrate support assembly. The protective ring for a substrate support assembly includes an annular body including a first top surface and a first bottom surface; a protrusion disposed along an inner perimeter of the annular body and including a second top surface and a second bottom surface, the second top surface being disposed below the first top surface; and a skirt disposed along an outer perimeter of the annular body and extending downwardly from the first bottom surface. The skirt, the protrusion, and the first bottom surface form a groove under the annular body. The groove is configured to receive the edge electrode. Both the edge voltage delivery system and the substrate support assembly include the protective ring and the edge electrode.

Abstract: Presented are compositions that can be used as protective coatings for agricultural (e.g., food) substrates. The compositions can comprise a compound of Formula I: and an additive, wherein the variables m, n, q, r, Ra, Rb, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12 and R13 are defined herein. The protective coatings formed from the compositions can be used to prevent food spoilage due to, for instance, moisture loss, oxidation, or infection by a foreign pathogen.

Abstract: An electric compressor includes a housing, refrigerant inlet port, a refrigerant outlet port, an inverter section, a motor section, a compression device and a front cover. The housing defines an intake volume and a discharge volume. The refrigerant inlet port is coupled to the housing and is configured to introduce the refrigerant to the intake volume. The compression device is a scroll-type compression device configured to compress the refrigerant. The refrigerant outlet port is coupled to the housing and is configured to allow compressed refrigerant to exit the scroll-type electric compressor from the discharge volume. The electric compressor including a scroll backpressure system, located at least partially, within a compression device body.

Abstract: Embodiments provided herein generally include apparatus, e.g., plasma processing systems and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to improving process uniformity across the surface of the substrate, reducing defectivity on the surface of the substrate, or both. In some embodiments, the apparatus and methods provide for improved control over the uniformity of a plasma formed over the edge of a substrate and/or the distribution of ion energies at the surface of the substrate. The improved control over the plasma uniformity may be used in combination with substrate handling methods, e.g., de-chucking methods, to reduce particulate-related defectivity on the surface of the substrate. In some embodiments, the improved control over the plasma uniformity is used to preferentially clean accumulated processing byproducts from portions of the edge ring during an in-situ plasma chamber cleaning process.