Patents by Inventor James Roman
James Roman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10487884Abstract: A clutch mechanism includes a meshing arrangement between a first plurality of teeth on a first component coupled to a driven shaft and a corresponding second plurality of teeth on a second component coupled to a driving shaft.Type: GrantFiled: May 23, 2017Date of Patent: November 26, 2019Assignee: Premier Coil Solutions, Inc.Inventors: Randall Dean Behrens, Kevin James Roman
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Publication number: 20170370421Abstract: A clutch mechanism includes a meshing arrangement between a first plurality of teeth on a first component coupled to a driven shaft and a corresponding second plurality of teeth on a second component coupled to a driving shaft.Type: ApplicationFiled: May 23, 2017Publication date: December 28, 2017Applicant: Premier Coil Solutions, Inc.Inventors: Randall Dean Behrens, Kevin James Roman
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Patent number: 9689437Abstract: A clutch mechanism includes a meshing arrangement between a first plurality of teeth on a first component coupled to a driven shaft and a corresponding second plurality of teeth on a second component coupled to a driving shaft.Type: GrantFiled: June 23, 2016Date of Patent: June 27, 2017Assignee: Premier Coil Solutions, Inc.Inventors: Randall Dean Behrens, Kevin James Roman
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Publication number: 20080025009Abstract: A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the electrode but insulated from the electrode. Capacitor dielectric (320) can be formed by anodizing tantalum while a nickel layer (314) protects an underlying copper (310) from the anodizing solution. This protection allows the tantalum layer to be made thin to obtain large capacitance. Chemical mechanical polishing of a layer (610) is made faster, and hence possibly less expensive, by first patterning the layer photolithographically to form, and/or increase in height, upward protrusions of this layer.Type: ApplicationFiled: October 2, 2007Publication date: January 31, 2008Inventors: Sergey Savastiouk, Valentin Kosenko, James Roman
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Publication number: 20070257367Abstract: A portion of a conductive layer (310, 910) provides a capacitor electrode (310.0, 910.0). Dielectric trenches (410, 414, 510) are formed in the conductive layer to insulate the capacitor electrode from those portions of the conductive layer which are used for conductive paths passing through the electrode but insulated from the electrode. Capacitor dielectric (320) can be formed by anodizing tantalum while a nickel layer (314) protects an underlying copper (310) from the anodizing solution. This protection allows the tantalum layer to be made thin to obtain large capacitance. Chemical mechanical polishing of a layer (610) is made faster, and hence possibly less expensive, by first patterning the layer photolithographically to form, and/or increase in height, upward protrusions of this layer.Type: ApplicationFiled: May 5, 2006Publication date: November 8, 2007Inventors: Sergey Savastiouk, Valentin Kosenko, James Roman
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Patent number: 7059609Abstract: A multilayer metal gasket has a pair of outer active layers separated by an intermediate layer. The outer active layers are formed with at least one pair of aligned apertures and sealing beads surrounding the apertures in radially outwardly spaced relation thereto presenting laterally opposed sealing surfaces of the active layers of predetermined spacing or thickness when the gasket is in a compressed free state. The intermediate layer extends radially inwardly beyond the apertures and is provided with a cold formed stopper portion having a thickness greater than the combined material thicknesses of the intermediate layer and outer active layers but less than the thickness of the sealing beads. The stopper portion is cold formed under a compressive load exceeding the compressive load required to deform the sealing beads beyond their elastic limit, thereby preventing irreversible damage to the sealing beads.Type: GrantFiled: June 13, 2000Date of Patent: June 13, 2006Assignee: Federal-Mogul World Wide, Inc.Inventors: Edward James Locke, James Roman Zwick
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Patent number: 6898343Abstract: A hybrid integration process for fabrication of an optical cross-connect switching apparatus. The switching element is based on the deflection of light beam in electro-optic materials by applying electric field across electrodes of an appropriate configuration. The integration process includes fabrication of a substrate (e.g. silicon substrate) with 2D imaging optics from polymeric materials (or silica), fabrication of the light deflecting element, and assembly of the deflecting element on the substrate with imaging optics. The fabrication of the light deflecting element includes fabrication of a LN (lithium niobate) block. The LN block assembled in an optical switching apparatus includes a two-dimensional waveguide formed on a surface of the LN block and an electrode on a surface of the LN block.Type: GrantFiled: August 17, 2001Date of Patent: May 24, 2005Assignee: Fujitsu LimitedInventors: Alexei Glebov, Michael Peters, Michael Lee, James Roman, David Kudzuma
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Patent number: 6785447Abstract: An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveguide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. Methods of producing the optoreflective structure are disclosed.Type: GrantFiled: January 22, 2001Date of Patent: August 31, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Patent number: 6684007Abstract: An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide.Type: GrantFiled: May 9, 2001Date of Patent: January 27, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Mark Thomas McCormack, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Patent number: 6669801Abstract: A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.Type: GrantFiled: May 9, 2001Date of Patent: December 30, 2003Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, James Roman, Wen-chou Vincent Wang, Masaaki Inao, Mark Thomas McCormack
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Patent number: 6572780Abstract: Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.Type: GrantFiled: May 31, 2001Date of Patent: June 3, 2003Assignee: Fujitsu LimitedInventors: Mark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Patent number: 6544430Abstract: Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.Type: GrantFiled: May 31, 2001Date of Patent: April 8, 2003Assignee: Fujitsu LimitedInventors: Mark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Publication number: 20030035614Abstract: A hybrid integration process for fabrication of an optical cross-connect switching apparatus. The switching element is based on the deflection of light beam in electro-optic materials by applying electric field across electrodes of an appropriate configuration. The integration process includes fabrication of a substrate (e.g. silicon substrate) with 2D imaging optics from polymeric materials (or silica), fabrication of the light deflecting element, and assembly of the deflecting element on the substrate with imaging optics. The fabrication of the light deflecting element includes fabrication of a LN (lithium niobate) block. The LN block assembled in an optical switching apparatus includes a two-dimensional waveguide formed on a surface of the LN block and an electrode on a surface of the LN block.Type: ApplicationFiled: August 17, 2001Publication date: February 20, 2003Inventors: Alexei Glebov, Michael Peters, Michael Lee, James Roman, David Kudzuma
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Publication number: 20020117256Abstract: Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.Type: ApplicationFiled: May 31, 2001Publication date: August 29, 2002Inventors: Mark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Publication number: 20020106522Abstract: Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.Type: ApplicationFiled: May 31, 2001Publication date: August 8, 2002Inventors: Mark Thomas McCormack, James Roman, Lei Zhang, Solomon I. Beilin
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Publication number: 20020097962Abstract: An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveduide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. A method for producing an optoreflective structure comprising providing a substrate supporting a first cladding layer having a first planar cladding surface; disposing a waveguide material on the first cladding layer; and forming on the waveguide material a second cladding layer having a second planar cladding surface.Type: ApplicationFiled: January 22, 2001Publication date: July 25, 2002Inventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Publication number: 20020036055Abstract: A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.Type: ApplicationFiled: May 9, 2001Publication date: March 28, 2002Inventors: Tetsuzo Yoshimura, James Roman, Wen-chou Vincent Wang, Masaaki Inao, Mark Thomas McCormack
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Publication number: 20020028045Abstract: An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide.Type: ApplicationFiled: May 9, 2001Publication date: March 7, 2002Inventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Mark Thomas McCormack, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao