Patents by Inventor James Rychwalski

James Rychwalski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic copper plating solutions
    Publication number: 20060183328
    Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Application
    Filed: August 12, 2005
    Publication date: August 17, 2006
    Inventors: Leon Barstad, James Rychwalski, Mark Lefebvre, Stephane Menard, James Martin, Robert Schetty, Michael Toben
  • Electrolytic copper plating solutions
    Publication number: 20060065537
    Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Application
    Filed: August 17, 2005
    Publication date: March 30, 2006
    Inventors: Leon Barstad, James Rychwalski, Mark Lefebvre, Stephane Menard, James Martin, Robert Schetty, Michael Toben
  • ELECTROLYTIC COPPER PLATING SOLUTIONS
    Publication number: 20010047943
    Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Application
    Filed: May 17, 1999
    Publication date: December 6, 2001
    Inventors: LEON BARSTAD, JAMES RYCHWALSKI, MARK LEFEBVRE, STEPHANE MENARD, JAMES MARTIN, ROBERT SCHETTY, MICHAEL TOBEN
  • Pretreatment process for electroless plating of polyimides
    Patent number: 5178956
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: January 12, 1993
    Assignee: Shipley Company Inc.
    Inventors: James Rychwalski, Paul J. Ciccolo, Edward C. Couble
  • Electrophoretic method for applying photoresist to three dimensional circuit board substrate
    Patent number: 5004672
    Abstract: A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby (a) providing the board with a conductive surface and (b) applying a photoresist by electrophoretic deposition.
    Type: Grant
    Filed: July 10, 1989
    Date of Patent: April 2, 1991
    Assignee: Shipley Company Inc.
    Inventors: Eugene D. D'Ottavio, Robert E. Hawkins, Stephen S. Rodriguez, James Rychwalski