Abstract: An test block includes a box-like body and four rails extending from side edges of the body. During thermal testing, the test block is mounted between a test head and a test socket such that the rails provide a thermal path between the test block body and contact pads formed on the test socket. In this manner the rails emulate the thermal path formed by the metal leads extending from a conventional Quad Flat Pack Integrated Circuit (QFP IC), thereby reliably duplicating the actual thermal path of the QFP IC. The test block is mounted on the test system and its temperature is measured before and after testing QFP IC devices. Confirming that the test block is within test temperature specifications before and after the QFP-IC test procedure provides a highly reliable verification that the QFP-IC's actual test temperature is within the test temperature specifications.