Abstract: A breading and sifting apparatus is disclosed. The breading and sifting apparatus may include a sifter and a frame. The sifter is configured to be placed beneath a working surface. The working surface includes an opening. A breading lug is configured to be placed through the opening into the frame of the sifter, such that the sifter is retained relative to the working surface.

Abstract: The disclosed apparatus relates to a stringed practice device comprising: a neck with an upper end and a lower end; a headstock coupled to the lower end of the neck; and where the headstock comprises a plurality of tuning posts. The disclosed method relates to a using a stringed practice device. The method comprises resting a headstock against a thigh of the user; and fingering the strings on a neck of the stringed practice device with one hand of the user.

Abstract: A method for electronically encoding an article with work-in-progress information includes determining a work-in-progress condition of the article and setting an encoding device attached to the article to a set-point corresponding to the work-in-progress condition. Determining the work-in-progress condition includes identifying a present work-in-progress condition of the article and at least one historical work-in-progress condition of the article. Adjusting the encoding device includes adjusting the encoding device from a first set-point of a first set-point set to a first set-point of a second set-point set in response to passing a first work-in-progress evaluation, and adjusting the encoding device from the first set-point of the second set-point set to a second set-point of the first set-point set in response to failing a second work-in-progress evaluation after passing the first work-in-progress evaluation.

Abstract: An apparatus is provided for retaining a production level device for use with an automated testing device for testing personal computer components. The apparatus includes an extrusion having a first portion for receiving the production level device and a second portion for attaching the extrusion to the automated test device. The apparatus also includes a moldable fastener for precisely fastening the production-level device to the first portion.

Abstract: An apparatus is provided for retaining a production level device for use with an automated testing device for testing personal computer components. The apparatus includes an extrusion having a first portion for receiving the production level device and a second portion for attaching the extrusion to the automated test device. The apparatus also includes a moldable fastener for precisely fastening the production-level device to the first portion.

Abstract: A printed circuit board assembly testing device includes a LISN device connected to a power source and to a test enclosure. The test enclosure includes a power supply and a communication port. A signal analyzer is interfaced to the LISN device. A circuit board assembly unit under test is positioned in the test enclosure. A controlling computer is interfaced to the communication port. The controlling computer includes a hard disk storage device having benchmark data stored therein. A communication bus interconnects the controlling computer to the signal analyzer. The unit under test is powered up and emissions data is observed which correlates to activity in the unit under test. The emissions data is compared to the benchmark data and a determination can be made as to whether the observed data meets the benchmark data within an acceptable tolerance.

Abstract: A hold-down finger for holding a circuit board in a test fixture. The hold-down finger includes an attachment portion and a finger. The attachment portion is for attaching the hold-down finger to the test fixture. The attachment portion has a central axis. The finger is coupled to the attachment portion at a location displaced from the central axis of the attachment portion. Displacing the finger from the central axis allows for the tip of the finger to be located more precisely in a radial manner about the center point of the device to hold a circuit board down against the extreme pressures of test probe springs.

Abstract: A test apparatus and method for fully testing the functional aspects of a computer system at the system level through one or more of its I/O ports. A test system is connected to an externally available I/O port of the computer under test for accessing its system ROM and a jumper is installed on the computer under test to disable its system ROM. The jumper also bypasses the PCMCIA controller, if necessary, to provide the test system direct access to the I/O port and thus the system ROM. The computer under test is booted from diagnostic test code stored in memory of the test system, where the diagnostic test code has complete control and performs a series of tests on the computer under test. Other I/O ports of the computer under test, including its serial ports, parallel port, keyboard and mouse ports, video port and a docking port may also be connected to the test system, if desired.

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a retainer for releasably securing the electrical component to the PGA socket.

Abstract: An improved test probe for use with a bed of nails type test fixture is disclosed. The test probe comprises a probe body having a test head at one end for contacting test points on a DUT placed in a test fixture and an annular ring disposed around the circumference thereof proximate the center of the probe. A nonconductive tubular sheath is disposed over the test head and affixed at one end to the test probe by the annular ring. The other end of the sheath extends beyond the test head such that the test head is recessed within the sheath a distance defined by component lead length and PCB thickness fault tolerances and acceptable float. In this manner, the test probe enables the detection of PCB faults caused by missing or improperly or incorrectly inserted plated through-hole mounted components.

Abstract: A rework configuration is provided for disconnecting defective lithography-formed conductors and/or overlying electrical components from the printed circuit wiring netlist and connecting rework elements at the substituted sites. In particular, defective regions can be severed at spaced first and second target areas the upper surface of the PCB and one or more interconnect structures can be coupled therebetween. The interconnect structures allow re-routing of PCB conductors, allow connectivity between the upper and lower surfaces, allow connectivity to power and ground planes, and allow pull-up, pull-down and decoupling connectivity.

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a retainer for releasably securing the electrical component to the PGA socket.

Abstract: A rework configuration is provided for disconnecting defective lithography-formed conductors and/or overlying electrical components from the printed circuit wiring netlist and connecting rework elements at the substituted sites. In particular, defective regions can be severed at spaced first and second target areas upon the upper surface of the PCB and one or more interconnect structures can be coupled therebetween. The interconnect structures allow re-routing of PCB conductors, allow connectivity between the upper and lower surfaces, allow connectivity to power and ground planes, and allow pull-up, pull-down and decoupling connectivity.

Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a means for releasably securing the electrical component to the PGA socket.

Abstract: There is disclosed a technique for constructing a printed circuit board assembly to provide solder joints with a uniform height. A solder mask is provided on the external surfaces of the printed circuit board to minimize the mount of conductive pad area that is exposed to solder. The solder mask includes a plurality of relatively small openings with a predetermined pattern to minimize the build up of solder, while insuring sufficient solder height to connect to the grounding component located on the chassis to insure adequate EMI protection. Preferably a polka dot pattern is used for certain conductive pads, while a single narrow strip or the solder mask opening configuration is used for rectangular pad configurations. Other configurations and patterns are also available to provide an adequate electrical connection while insuring uniform solder height.

Abstract: A system for detecting and locating errors in printed wire assemblies contained in a device with capabilities of performing a power on self test (POST) comprised of testing subroutines. The system monitors the device during execution of the POST. If a run error occurs during the POST, the system, through its monitoring, receives an indication of the run error. The system then delivers to the device a command, external to the POST routine, which directs the POST routine to thereafter separately execute each of the testing subroutines of the POST. If a run error occurs in any testing subroutine as it is being separately executed, a signal indicative of the run error and particular testing subroutine in which it occurred is sent to the system.

Abstract: A printed circuit board is provided having a beveled edge for ease of insertion into a receptor. The beveled edge is extended onto the solder mask to present a contiguous beveled surface. Moreover, the PCB includes bonding pads which can be surface mounted with pins extending from the receptor. Each bonding pad includes a forward portion and a rearward portion. The forward portion is covered with the solder mask layer to present a smooth surface channeled inward in a V-shaped configuration. The forward portion channels or directs the pin along a central axis near the apex of the V-shaped forward portion onto the upper surface of the bonding pad rearward portion. Accordingly, the pin is channeled to an area absent solder paste along the central axis such that during subsequent reflow operation the solder paste is reliably extended over and around the centrally placed pin.

Abstract: A circuit board design featuring a fine pitch ball grid array ("BGA") having a simplified construction. The circuit board comprises: (1) an insulating substrate, the substrate having a via therethrough, (2) a conductive layer located over the substrate, the via passing through the layer and laterally uninterrupted through the circuit board, (3) a first solder having a first melting point located within and substantially blocking the via and (4) a second solder having a second melting point located over the blocked via, the second melting point lower than the first melting point, the first solder remaining substantially solid and preventing the second solder from substantially entering the via when the first and second solders are heated to a temperature between the first and second melting points. The present invention eliminates precision drilling required by current blind via BGA pad designs.

Abstract: A railroad hopper ballast discharge door assembly includes pliant side panels along a discharge gate opening. The pliant side panels are strong enough to retain the ballast within the hopper when the door is closed, yet are flexible enough to yield when ballast flowing out of the hopper becomes wedged between the side panel and the door as the door closes. Strengthening ribs reinforce the pliant side panels and may be embedded within them. The discharge door assembly is readily adapted for automatic, motor-actuated operation.

Abstract: A railroad maintenance device distributes, regulates and reclaims ballast along a railway road bed. The device includes one or more hopper cars for transporting and depositing ballast, a regulating car including a track regulator, a shoulder regulator, and an extensible plow arm for reclaiming ballast deposited at a distance from the shoulder of the road bed. The hopper cars include radio controlled gates for the remote control of ballast depositing operations, and a computer controlled system for optimizing the distribution of ballast according to predetermined parameters. A bucket elevator is located rearwardly of the track regulator for lifting excess ballast from the road bed, and a belt conveyor transports the lifted ballast to a hopper car.