Patents by Inventor James S. Donley

James S. Donley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free integrated circuit package structure
    Patent number: 7180170
    Abstract: An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: February 20, 2007
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Phillip C. Celaya, James S. Donley, Stephen C. St. Germain
  • Method of making a lead-free integrated circuit package
    Patent number: 6889429
    Abstract: An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: May 10, 2005
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Phillip C. Celaya, James S. Donley, Stephen C. St. Germain
  • Integrated circuit package and method
    Publication number: 20020134582
    Abstract: An integrated circuit package(60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
    Type: Application
    Filed: March 26, 2001
    Publication date: September 26, 2002
    Applicant: Semiconductor Components Industries, LLC.
    Inventors: Phillip C. Celaya, James S. Donley, Stephen C. St. Germain