Abstract: In some embodiments, phonon based temperature measuring apparatuses include a light source positioned to direct a light toward a prism-resonant cavity interface of an optical resonant cavity inducing an evanescent wave that is guided into the resonant cavity having surface phonon polariton properties; a detector positioned proximate the resonant cavity and configured to detect reflected light from the prism-resonant cavity interface; and a temperature calculator coupled with the detector and configured to determine evanescent light coupling to one or more phonon polariton modes from the resonant cavity, calculate a quality factor as a function of a frequency spectrum of at least one of the one or more phonon polariton modes, and determine a temperature of a dielectric material within the resonant cavity as a function of the quality factor.

Abstract: The present disclosure provides methods of applying a filtering coating to a substrate, comprising: depositing a solution on a surface of a substrate, wherein the solution comprises an organic solvent with nanorods dispersed within the solvent. Evaporation of the solution is allowed and/or controlled to increase a volume fraction of the nanorods in the solution as a function of the evaporation. Thus, an aligned deposit of the nanorods is provided as a function of the evaporation, wherein the aligned deposit of nanorods includes at least thousands of the nanorods with at least a majority of the nanorods aligned relative to a length of the nanorods.

Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.

Abstract: A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.