Patents by Inventor James S. Hileman

James S. Hileman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer assembly and method
    Patent number: 11223152
    Abstract: An interposer assembly including a plate and a plurality of conductive contacts extending through plate passages for forming electrical connections with pads on overlying and underlying substrates.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: January 11, 2022
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: Paul R. Taylor, Trent Do, James S. Hileman
  • Interposer Assembly and Method
    Publication number: 20200274277
    Abstract: An interposer assembly including a plate and a plurality of conductive contacts extending through plate passages for forming electrical connections with pads on overlying and underlying substrates.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 27, 2020
    Inventors: Paul R. Taylor, Trent Do, James S. Hileman
  • Interposer assembly and method
    Patent number: 9425525
    Abstract: The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 23, 2016
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman, Charles Sands Pickles
  • Interposer Assembly and Method
    Publication number: 20160087360
    Abstract: The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.
    Type: Application
    Filed: September 18, 2015
    Publication date: March 24, 2016
    Inventors: John D. Walden, James S. Hileman, Charles Sands Pickles
  • Impedance controlled LGA interposer assembly
    Patent number: 9172161
    Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: October 27, 2015
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman
  • Impedance Controlled LGA Interposer Assembly
    Publication number: 20140162472
    Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may form an impedance shield for reducing impedance between adjacent signal contacts.
    Type: Application
    Filed: May 21, 2013
    Publication date: June 12, 2014
    Applicant: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman