Patents by Inventor James S. Wilson

James S. Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240055318
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • Patent number: 11837521
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 5, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • Publication number: 20230341190
    Abstract: A method includes using electroforming to deposit a first portion of material. The method also includes placing a preformed tube on the first portion of material, where the preformed tube includes multiple capillary pathways and multiple bends. The method further includes using electroforming to deposit a second portion of material over the first portion of material and over the preformed tube to form a heat exchanger. The preformed tube forms at least a portion of a pulsating heat pipe within the heat exchanger, and the pulsating heat pipe is configured to transport thermal energy through the heat exchanger.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 26, 2023
    Inventors: Trae M. Blain, James S. Wilson
  • Publication number: 20230302567
    Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
    Type: Application
    Filed: June 2, 2023
    Publication date: September 28, 2023
    Applicant: Raytheon Company
    Inventors: Travis Lee Mayberry, Cory Thomas, Robert Arthur Condie, James S. Wilson
  • Patent number: 11686539
    Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: June 27, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: James S. Wilson, James Giesey
  • Patent number: 11682814
    Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: June 20, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: Karl L. Worthen, James S. Wilson, Joshua Lamb
  • Patent number: 11679445
    Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: June 20, 2023
    Assignee: Raytheon Company
    Inventors: Travis Lee Mayberry, Cory Thomas, Robert Arthur Condie, James S. Wilson
  • Patent number: 11653473
    Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 16, 2023
    Assignee: Raytheon Company
    Inventors: James S. Wilson, Gordon R. Scott, James M. Giesey
  • Publication number: 20220407207
    Abstract: A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Karl L. Worthen, James S. Wilson, Joshua Lamb
  • Publication number: 20220336319
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 20, 2022
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • Patent number: 11350490
    Abstract: A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 31, 2022
    Assignee: Raytheon Company
    Inventors: James S. Wilson, Joshua Lamb, Steven P. McFarlane
  • Publication number: 20220161343
    Abstract: A process for building a high-performance liquid flow-through plate is provided and includes providing a substrate formed of metal matrix composite (MMC) material, metallizing a surface of the substrate to reform the surface into a metallized surface, placing a braze foil on the metallized surface and executing a high-temperature and high-pressure bake whereby material of the braze foil diffuses into the metallized surface.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 26, 2022
    Inventors: Trae M. Blain, James S. Wilson
  • Publication number: 20220143736
    Abstract: A method for making a cold plate includes the steps of positioning a finstock structure in a cavity of a substrate; and applying a cover to the finstock structure and substrate, wherein the applying step comprises ultrasonically additive manufacturing the cover to the substrate and the finstock structure, whereby the cover joins with the substrate and the finstock structure. The resulting cold plate assembly includes a substrate having a cavity, a finstock structure within the cavity, and a cover closing the finstock structure within the cavity, the cover being integrally joined to the substrate and to the finstock structure.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 12, 2022
    Applicant: Raytheon Company
    Inventors: Travis Lee Mayberry, Cory Thomas, Robert Arthur Condie, James S. Wilson
  • Patent number: 11226141
    Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: January 18, 2022
    Assignee: Raytheon Company
    Inventors: James S. Wilson, Alex E. Ockfen, Adolfo Lozano, III, Amanda S. Rickman
  • Publication number: 20210352825
    Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
    Type: Application
    Filed: May 5, 2020
    Publication date: November 11, 2021
    Inventors: James S. Wilson, Gordon R. Scott, James M. Giesey
  • Publication number: 20210278146
    Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.
    Type: Application
    Filed: March 9, 2020
    Publication date: September 9, 2021
    Applicant: Raytheon Company
    Inventors: James S. Wilson, James Giesey
  • Publication number: 20190170406
    Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 6, 2019
    Inventors: James S. Wilson, Alex E. Ockfen, Adolfo Lozano, III, Amanda S. Rickman
  • Publication number: 20180263079
    Abstract: A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.
    Type: Application
    Filed: March 8, 2017
    Publication date: September 13, 2018
    Inventors: James S. Wilson, Joshua Lamb, Steven P. McFarlane
  • Patent number: 9942975
    Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: April 10, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: James M. Elliott, James S. Wilson, David E. Swernofsky
  • Publication number: 20170099726
    Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
    Type: Application
    Filed: October 5, 2015
    Publication date: April 6, 2017
    Inventors: James M. Elliott, James S. Wilson, David E. Swernofsky